Inventor
ESTACIO MARIA CRISTINA
PH24 patents
⚠️ This page may combine multiple inventors who share the name “ESTACIO MARIA CRISTINA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMICONDUCTOR COMPONENTS IND LLC
16 patentsUS10319670B2Jun 11, 2019
Package including multiple semiconductor devices
SEMICONDUCTOR COMPONENTS IND LLC1 citations73
US11621203B2Apr 4, 2023
SiC MOSFET semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC2 citations72
US11088046B2Aug 10, 2021
Semiconductor device package with clip interconnect and dual side cooling
SEMICONDUCTOR COMPONENTS IND LLC3 citations72
US11984424B2May 14, 2024
Semiconductor packages using package in package systems and related methods
SEMICONDUCTOR COMPONENTS IND LLC2 citations71
US11791247B2Oct 17, 2023
Concealed gate terminal semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC2 citations70
US12463103B2Nov 4, 2025
SiC MOSFET semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12142551B2Nov 12, 2024
Package including multiple semiconductor devices
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11545421B2Jan 3, 2023
Package including multiple semiconductor devices
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US10910297B2Feb 2, 2021
Package including multiple semiconductor devices
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12417999B2Sep 16, 2025
Semiconductor packages using package in package systems and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations61
US12205918B2Jan 21, 2025
Submodule semiconductor package
SEMICONDUCTOR COMPONENTS IND LLC0 citations61
US12051635B2Jul 30, 2024
Semiconductor device package with clip interconnect and dual side cooling
SEMICONDUCTOR COMPONENTS IND LLC0 citations61
US12300583B2May 13, 2025
Concealed gate terminal semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations59
US11735508B2Aug 22, 2023
Vertical and horizontal circuit assemblies
SEMICONDUCTOR COMPONENTS IND LLC0 citations59
US12278169B2Apr 15, 2025
Electronic device packaging with galvanic isolation
SEMICONDUCTOR COMPONENTS IND LLC0 citations57
US10943855B2Mar 9, 2021
Electronic device packaging with galvanic isolation
SEMICONDUCTOR COMPONENTS IND LLC0 citations57
FAIRCHILD SEMICONDUCTOR
8 patentsUS9536800B2Jan 3, 2017
Packaged semiconductor devices and methods of manufacturing
FAIRCHILD SEMICONDUCTOR8 citations83
US9177925B2Nov 3, 2015
Apparatus related to an improved package including a semiconductor die
FAIRCHILD SEMICONDUCTOR7 citations80
US11177203B2Nov 16, 2021
Vertical and horizontal circuit assemblies
FAIRCHILD SEMICONDUCTOR0 citations59
US9478519B2Oct 25, 2016
Package including a semiconductor die and a capacitive component
FAIRCHILD SEMICONDUCTOR2 citations59
US11296069B2Apr 5, 2022
Substrate interposer on a leaderframe
FAIRCHILD SEMICONDUCTOR0 citations56
US10256178B2Apr 9, 2019
Vertical and horizontal circuit assemblies
FAIRCHILD SEMICONDUCTOR0 citations49
US10546847B2Jan 28, 2020
Substrate interposer on a leadframe
FAIRCHILD SEMICONDUCTOR0 citations46
US9685398B2Jun 20, 2017
Thin semiconductor device packages
FAIRCHILD SEMICONDUCTOR0 citations32