P

Inventor

HA TAE-HONG

KR36 patents
⚠️ This page may combine multiple inventors who share the name “HA TAE-HONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

25 patents
US9677172B2Jun 13, 2017

Methods for forming a cobalt-ruthenium liner layer for interconnect structures

APPLIED MATERIALS INC8 citations83
US12211743B2Jan 28, 2025

Method of forming a metal liner for interconnect structures

APPLIED MATERIALS INC3 citations73
US11764157B2Sep 19, 2023

Ruthenium liner and cap for back-end-of-line applications

APPLIED MATERIALS INC2 citations73
US10002834B2Jun 19, 2018

Method and apparatus for protecting metal interconnect from halogen based precursors

APPLIED MATERIALS INC3 citations73
US11562909B2Jan 24, 2023

Directional selective junction clean with field polymer protections

APPLIED MATERIALS INC2 citations72
US9938622B2Apr 10, 2018

Method to deposit CVD ruthenium

APPLIED MATERIALS INC2 citations72
US11270911B2Mar 8, 2022

Doping of metal barrier layers

APPLIED MATERIALS INC2 citations71
US10157787B2Dec 18, 2018

Method and apparatus for depositing cobalt in a feature

APPLIED MATERIALS INC4 citations71
US12243774B2Mar 4, 2025

Impurity removal in doped ALD tantalum nitride

APPLIED MATERIALS INC0 citations62
US12157943B2Dec 3, 2024

Methods of selective deposition

APPLIED MATERIALS INC0 citations62
US11784127B2Oct 10, 2023

Ruthenium liner and cap for back-end-of-line

APPLIED MATERIALS INC0 citations62
US11410881B2Aug 9, 2022

Impurity removal in doped ALD tantalum nitride

APPLIED MATERIALS INC1 citations62
US11171046B2Nov 9, 2021

Methods for forming cobalt and ruthenium capping layers for interconnect structures

APPLIED MATERIALS INC0 citations62
US12463052B2Nov 4, 2025

Directional selective junction clean with field polymer protections

APPLIED MATERIALS INC0 citations61
US12347695B2Jul 1, 2025

Methods for controlling contact resistance in cobalt-titanium structures

APPLIED MATERIALS INC0 citations61
US11948836B2Apr 2, 2024

Deposition of metal films with tungsten liner

APPLIED MATERIALS INC0 citations61
US11424132B2Aug 23, 2022

Methods and apparatus for controlling contact resistance in cobalt-titanium structures

APPLIED MATERIALS INC0 citations61
US11171045B2Nov 9, 2021

Deposition of metal films with tungsten liner

APPLIED MATERIALS INC0 citations61
US10892186B2Jan 12, 2021

Integration of ALD copper with high temperature PVD copper deposition for BEOL interconnect

APPLIED MATERIALS INC0 citations61
US11527437B2Dec 13, 2022

Methods and apparatus for intermixing layer for enhanced metal reflow

APPLIED MATERIALS INC0 citations52
US11587873B2Feb 21, 2023

Binary metal liner layers

APPLIED MATERIALS INC0 citations51
US11417568B2Aug 16, 2022

Methods for selective deposition of tungsten atop a dielectric layer for bottom up gapfill

APPLIED MATERIALS INC0 citations51
US10714388B2Jul 14, 2020

Method and apparatus for depositing cobalt in a feature

APPLIED MATERIALS INC0 citations51
US11939666B2Mar 26, 2024

Methods and apparatus for precleaning and treating wafer surfaces

APPLIED MATERIALS INC0 citations50
US10014179B2Jul 3, 2018

Methods for forming cobalt-copper selective fill for an interconnect

APPLIED MATERIALS INC0 citations41

SAMSUNG ELECTRONICS CO LTD

4 patents

(unassigned)

2 patents

HA TAE HONG

2 patents

HA TAE-HONG

2 patents

HA MIN SOO

1 patent