Inventor

SAKUMA KAZUO

JP20 patents

⚠️ This page may combine multiple inventors who share the name “SAKUMA KAZUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAKUMA KAZUO

TESSERA INC

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Substrate and assembly thereof with dielectric removal for increased post height

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Substrate and assembly thereof with dielectric removal for increased post height

SAKUMA KAZUO

Substrate and assembly thereof with dielectric removal for increased post height

Flip chip package for DRAM with two underfill materials

ADEIA SEMICONDUCTOR SOLUTIONS LLC

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

TOKYO SHIBAURA ELECTRIC CO

Humidity-sensitive element and process for producing the same

Humidity-sensitive resistive element

SATO HIROAKI

Package-on-package assembly with wire bonds to encapsulation surface

MITSUBISHI HEAVY IND LTD

Radiation-detecting light-transmission apparatus

YAMABIKO CORP

Helmet

TESSERA LLC

Package-on-package assembly with wire bonds to encapsulation surface

INVENSAS CORP

Methods of fabricating a flip chip package for dram with two underfill materials

SAKAI NORIHIRO

Illuminating device for reducing unevenness in illuminance on an irradiation target face