Inventor
GOH KOK CHAI
MY8 patents
⚠️ This page may combine multiple inventors who share the name “GOH KOK CHAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
7 patentsUS11842975B2Dec 12, 2023
Electronic device with multi-layer contact and system
INFINEON TECHNOLOGIES AG2 citations71
US9209152B2Dec 8, 2015
Molding material and method for packaging semiconductor chips
INFINEON TECHNOLOGIES AG5 citations67
US12255168B2Mar 18, 2025
Electronic device with multi-layer contact and system
INFINEON TECHNOLOGIES AG0 citations61
US9054063B2Jun 9, 2015
High power single-die semiconductor package
INFINEON TECHNOLOGIES AG3 citations57
US10475761B2Nov 12, 2019
Method for producing electronic device with multi-layer contact
INFINEON TECHNOLOGIES AG0 citations50
US9275944B2Mar 1, 2016
Semiconductor package with multi-level die block
INFINEON TECHNOLOGIES AG0 citations48
US9373609B2Jun 21, 2016
Bump package and methods of formation thereof
INFINEON TECHNOLOGIES AG0 citations41