Inventor
KITABAYASHI HIROYUKI
JP29 patents
⚠️ This page may combine multiple inventors who share the name “KITABAYASHI HIROYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SUMITOMO ELECTRIC INDUSTRIES
20 patentsUS5838090ANov 17, 1998
Surface acoustic wave device
SUMITOMO ELECTRIC INDUSTRIES21 citations93
US5777422AJul 7, 1998
Diamond-ZnO surface acoustic wave device having relatively thinner ZnO piezoelectric layer
SUMITOMO ELECTRIC INDUSTRIES22 citations93
US7476909B2Jan 13, 2009
Light emitting device
SUMITOMO ELECTRIC INDUSTRIES29 citations92
US6320296B1Nov 20, 2001
Diamond wafer, method of estimating a diamond wafer and diamond surface acoustic wave device
SUMITOMO ELECTRIC INDUSTRIES31 citations92
US6210780B1Apr 3, 2001
Diamond wafer, method of estimating a diamond wafer and diamond surface acoustic wave device
SUMITOMO ELECTRIC INDUSTRIES17 citations92
US7423284B2Sep 9, 2008
Light emitting device, method for making the same, and nitride semiconductor substrate
SUMITOMO ELECTRIC INDUSTRIES10 citations84
US6356006B1Mar 12, 2002
Diamond wafer, method of estimating a diamond wafer and diamond surface acoustic wave device
SUMITOMO ELECTRIC INDUSTRIES5 citations74
US6025636AFeb 15, 2000
Surface acoustic wave device incorporating single crystal LiNbO3
SUMITOMO ELECTRIC INDUSTRIES14 citations74
US5814918ASep 29, 1998
Diamond-ZnO surface acoustic wave device
SUMITOMO ELECTRIC INDUSTRIES10 citations74
US9384981B2Jul 5, 2016
Method of manufacturing silicon carbide semiconductor device
SUMITOMO ELECTRIC INDUSTRIES2 citations63
US7560740B2Jul 14, 2009
Light-emitting device
SUMITOMO ELECTRIC INDUSTRIES2 citations63
US7547910B2Jun 16, 2009
Semiconductor light-emitting device and method of manufacturing semiconductor light-emitting device
SUMITOMO ELECTRIC INDUSTRIES4 citations63
US7491974B2Feb 17, 2009
Light-emitting device
SUMITOMO ELECTRIC INDUSTRIES4 citations63
US5783896AJul 21, 1998
Diamond-Zn0 surface acoustic wave device
SUMITOMO ELECTRIC INDUSTRIES2 citations63
US9330916B2May 3, 2016
Method of manufacturing silicon carbide semiconductor device
SUMITOMO ELECTRIC INDUSTRIES0 citations52
US9646834B2May 9, 2017
Method for manufacturing semiconductor device
SUMITOMO ELECTRIC INDUSTRIES0 citations42
US9543154B2Jan 10, 2017
Method for manufacturing semiconductor device
SUMITOMO ELECTRIC INDUSTRIES0 citations42
US9449823B2Sep 20, 2016
Method for manufacturing silicon carbide semiconductor device
SUMITOMO ELECTRIC INDUSTRIES0 citations42
US9331164B2May 3, 2016
Silicon carbide semiconductor device
SUMITOMO ELECTRIC INDUSTRIES0 citations42
US10056247B2Aug 21, 2018
Method of manufacturing silicon carbide semiconductor device
SUMITOMO ELECTRIC INDUSTRIES0 citations41
KOMATSU MFG CO LTD
5 patentsUS5531087AJul 2, 1996
Metal sheet bending machine
KOMATSU MFG CO LTD51 citations91
US5367902ANov 29, 1994
Metal sheet bending machine
KOMATSU MFG CO LTD19 citations72
US5243811ASep 14, 1993
Grinder and method of manufacturing the same
KOMATSU MFG CO LTD9 citations72
US5178497AJan 12, 1993
Electrodeposited reamer tool
KOMATSU MFG CO LTD9 citations70
US5151109ASep 29, 1992
Grinder and method of manufacturing the same
KOMATSU MFG CO LTD1 citations51