Inventor
DUONG ANH
US30 patents
⚠️ This page may combine multiple inventors who share the name “DUONG ANH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTERMOLECULAR INC
17 patentsUS9012322B2Apr 21, 2015
Selective etching of copper and copper-barrier materials by an aqueous base solution with fluoride addition
INTERMOLECULAR INC30 citations94
US7919446B1Apr 5, 2011
Post-CMP cleaning compositions and methods of using same
INTERMOLECULAR INC21 citations92
US9123785B1Sep 1, 2015
Method to etch Cu/Ta/TaN selectively using dilute aqueous HF/HCI solution
INTERMOLECULAR INC12 citations84
US7879710B2Feb 1, 2011
Substrate processing including a masking layer
INTERMOLECULAR INC6 citations74
US9337030B2May 10, 2016
Method to grow in-situ crystalline IGZO using co-sputtering targets
INTERMOLECULAR INC3 citations71
US9245848B2Jan 26, 2016
Methods for coating a substrate with an amphiphilic compound
INTERMOLECULAR INC3 citations71
US9343408B2May 17, 2016
Method to etch Cu/Ta/TaN selectively using dilute aqueous HF/H2SO4 solution
INTERMOLECULAR INC2 citations63
US8575021B2Nov 5, 2013
Substrate processing including a masking layer
INTERMOLECULAR INC4 citations63
US8871860B2Oct 28, 2014
Methods for coating a substrate with an amphiphilic compound
INTERMOLECULAR INC1 citations61
US8853081B2Oct 7, 2014
High dose ion-implanted photoresist removal using organic solvent and transition metal mixtures
INTERMOLECULAR INC3 citations60
US9224639B2Dec 29, 2015
Method to etch cu/Ta/TaN selectively using dilute aqueous Hf/hCl solution
INTERMOLECULAR INC1 citations52
US8926758B2Jan 6, 2015
Composition and method for removing photoresist and bottom anti-reflective coating for a semiconductor substrate
INTERMOLECULAR INC0 citations52
US7884036B1Feb 8, 2011
Methods for treating substrates in preparation for subsequent processes
INTERMOLECULAR INC0 citations52
US9399753B2Jul 26, 2016
Aqua regia and hydrogen peroxide HCL combination to remove Ni and NiPt residues
INTERMOLECULAR INC0 citations51
US8946015B2Feb 3, 2015
Aqua regia and hydrogen peroxide HCI combination to remove Ni and NiPt residues
INTERMOLECULAR INC0 citations51
US8809140B2Aug 19, 2014
Aqua regia and hydrogen peroxide HCl combination to remove Ni and NiPt residues
INTERMOLECULAR INC0 citations51
US8859431B2Oct 14, 2014
Process to remove Ni and Pt residues for NiPtSi application using chlorine gas
INTERMOLECULAR INC0 citations50
DUONG ANH
7 patentsUS8518765B1Aug 27, 2013
Aqua regia and hydrogen peroxide HCl combination to remove Ni and NiPt residues
DUONG ANH5 citations82
US8449681B2May 28, 2013
Composition and method for removing photoresist and bottom anti-reflective coating for a semiconductor substrate
DUONG ANH3 citations62
US8513117B2Aug 20, 2013
Process to remove Ni and Pt residues for NiPtSi applications
DUONG ANH2 citations60
US8894774B2Nov 25, 2014
Composition and method to remove excess material during manufacturing of semiconductor devices
DUONG ANH0 citations51
US8697573B2Apr 15, 2014
Process to remove Ni and Pt residues for NiPtSi applications using aqua regia with microwave assisted heating
DUONG ANH0 citations51
US8466058B2Jun 18, 2013
Process to remove Ni and Pt residues for NiPtSi applications using chlorine gas
DUONG ANH0 citations50
US8784572B2Jul 22, 2014
Method for cleaning platinum residues on a semiconductor substrate
DUONG ANH0 citations49