P

Inventor

DING SHAOFENG

US35 patents
⚠️ This page may combine multiple inventors who share the name “DING SHAOFENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

25 patents
US11043456B2Jun 22, 2021

Semiconductor devices

SAMSUNG ELECTRONICS CO LTD8 citations82
US11538747B2Dec 27, 2022

Interposer structure, semiconductor package comprising the same, and method for fabricating the same

SAMSUNG ELECTRONICS CO LTD6 citations73
US10892318B2Jan 12, 2021

Semiconductor device and method for fabricating the same

SAMSUNG ELECTRONICS CO LTD2 citations73
US11139286B2Oct 5, 2021

Semiconductor device including a capacitor structure and a thin film resistor and a method of fabricating the same

SAMSUNG ELECTRONICS CO LTD6 citations72
US11133266B2Sep 28, 2021

Semiconductor device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD3 citations72
US10867908B2Dec 15, 2020

Semiconductor device having buffer structure surrounding through via

SAMSUNG ELECTRONICS CO LTD3 citations72
US11114524B2Sep 7, 2021

Semiconductor device

SAMSUNG ELECTRONICS CO LTD3 citations71
US9831139B2Nov 28, 2017

Test structure and method of manufacturing structure including the same

SAMSUNG ELECTRONICS CO LTD2 citations71
US11094624B2Aug 17, 2021

Semiconductor device having capacitor

SAMSUNG ELECTRONICS CO LTD3 citations70
US12107034B2Oct 1, 2024

Semiconductor chip and semiconductor package including same

SAMSUNG ELECTRONICS CO LTD2 citations68
US12328882B2Jun 10, 2025

Semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations62
US12279408B2Apr 15, 2025

Semiconductor device and stack of semiconductor chips

SAMSUNG ELECTRONICS CO LTD0 citations62
US12199016B2Jan 14, 2025

Semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations62
US11961882B2Apr 16, 2024

Semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations62
US11876038B2Jan 16, 2024

Semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations62
US11871553B2Jan 9, 2024

Semiconductor device and stack of semiconductor chips

SAMSUNG ELECTRONICS CO LTD0 citations62
US11728311B2Aug 15, 2023

Semiconductor devices including interposer substrates further including capacitors

SAMSUNG ELECTRONICS CO LTD1 citations62
US11791267B2Oct 17, 2023

Semiconductor devices

SAMSUNG ELECTRONICS CO LTD0 citations61
US12408355B2Sep 2, 2025

Metal-insulator-metal capacitor

SAMSUNG ELECTRONICS CO LTD0 citations57
US11955509B2Apr 9, 2024

Metal-insulator-metal capacitor

SAMSUNG ELECTRONICS CO LTD0 citations57
US11437374B2Sep 6, 2022

Semiconductor device and stacked semiconductor chips including through contacts

SAMSUNG ELECTRONICS CO LTD0 citations57
US12014935B2Jun 18, 2024

Interposer and method of manufacturing the interposer

SAMSUNG ELECTRONICS CO LTD0 citations51
US11798883B2Oct 24, 2023

Semiconductor device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD0 citations51
US10535575B2Jan 14, 2020

Interposer, method of manufacturing interposer, and method of manufacturing semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations50
US12599040B2Apr 7, 2026

Three-dimensional integrated circuit structure and a method of fabricating the same

SAMSUNG ELECTRONICS CO LTD0 citations44

DING SHAOFENG

10 patents