Inventor
VANDENTOP GILROY J
US18 patents
⚠️ This page may combine multiple inventors who share the name “VANDENTOP GILROY J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
16 patentsUS6580611B1Jun 17, 2003
Dual-sided heat removal system
INTEL CORP176 citations99
US7359591B2Apr 15, 2008
Electrical/optical integration scheme using direct copper bonding
INTEL CORP24 citations92
US7355277B2Apr 8, 2008
Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package
INTEL CORP30 citations92
US7236666B2Jun 26, 2007
On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device
INTEL CORP19 citations92
US7063268B2Jun 20, 2006
Electro-active fluid cooling system
INTEL CORP26 citations92
US6792179B2Sep 14, 2004
Optical thumbtack
INTEL CORP35 citations92
US5844300ADec 1, 1998
Single poly devices for monitoring the level and polarity of process induced charging in a MOS process
INTEL CORP48 citations91
US6001699ADec 14, 1999
Highly selective etch process for submicron contacts
INTEL CORP24 citations90
US7703991B2Apr 27, 2010
Flip-chip mountable optical connector for chip-to-chip optical interconnectability
INTEL CORP10 citations84
US7569426B2Aug 4, 2009
Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package
INTEL CORP14 citations84
US6717066B2Apr 6, 2004
Electronic packages having multiple-zone interconnects and methods of manufacture
INTEL CORP14 citations84
US7826694B2Nov 2, 2010
Electrical/optical integration scheme using direct copper bonding
INTEL CORP7 citations74
US5549784AAug 27, 1996
Method for etching silicon oxide films in a reactive ion etch system to prevent gate oxide damage
INTEL CORP18 citations70
US7371630B2May 13, 2008
Patterned backside stress engineering for transistor performance optimization
INTEL CORP2 citations62
US7821073B2Oct 26, 2010
Patterned backside stress engineering for transistor performance optimization
INTEL CORP0 citations52
US7330357B2Feb 12, 2008
Integrated circuit die/package interconnect
INTEL CORP0 citations50