P

Inventor

YU CHUN-HSIEN

TW28 patents
⚠️ This page may combine multiple inventors who share the name “YU CHUN-HSIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PHOENIX PIONEER TECHNOLOGY CO LTD

19 patents
US11749612B2Sep 5, 2023

Semiconductor package device

PHOENIX PIONEER TECHNOLOGY CO LTD3 citations72
US9754982B2Sep 5, 2017

Packaging module and substrate structure thereof

PHOENIX PIONEER TECHNOLOGY CO LTD5 citations72
US11476204B2Oct 18, 2022

Flip-chip packaging substrate and method for fabricating the same

PHOENIX PIONEER TECHNOLOGY CO LTD2 citations71
US12094922B2Sep 17, 2024

Inductance traces protected through shielding layers

PHOENIX PIONEER TECHNOLOGY CO LTD0 citations62
US11404348B2Aug 2, 2022

Semiconductor package carrier board, method for fabricating the same, and electronic package having the same

PHOENIX PIONEER TECHNOLOGY CO LTD0 citations62
US11335630B2May 17, 2022

Semiconductor package substrate, electronic package and methods for fabricating the same

PHOENIX PIONEER TECHNOLOGY CO LTD0 citations62
US11183447B2Nov 23, 2021

Flip-chip package substrate and method for fabricating the same

PHOENIX PIONEER TECHNOLOGY CO LTD1 citations62
US12154866B2Nov 26, 2024

Method of fabricating a flip-chip package core substrate with build-up layers

PHOENIX PIONEER TECHNOLOGY CO LTD0 citations61
US9824964B2Nov 21, 2017

Package substrate, package structure including the same, and their fabrication methods

PHOENIX PIONEER TECHNOLOGY CO LTD1 citations52
US9711445B2Jul 18, 2017

Package substrate, package structure including the same, and their fabrication methods

PHOENIX PIONEER TECHNOLOGY CO LTD1 citations52
US11508673B2Nov 22, 2022

Semiconductor packaging substrate, fabrication method and packaging process thereof

PHOENIX PIONEER TECHNOLOGY CO LTD0 citations51
US11450597B2Sep 20, 2022

Semiconductor package substrate having heat dissipating metal sheet on solder pads, method for fabricating the same, and electronic package having the same

PHOENIX PIONEER TECHNOLOGY CO LTD0 citations51
US11139230B2Oct 5, 2021

Flip-chip package substrate and method for preparing the same

PHOENIX PIONEER TECHNOLOGY CO LTD0 citations51
US10366906B2Jul 30, 2019

Electronic package and its package substrate

PHOENIX PIONEER TECHNOLOGY CO LTD0 citations51
US9852977B2Dec 26, 2017

Package substrate

PHOENIX PIONEER TECHNOLOGY CO LTD0 citations51
US11646331B2May 9, 2023

Package substrate

PHOENIX PIONEER TECHNOLOGY CO LTD0 citations50
US10745818B2Aug 18, 2020

Method of fabricating package substrates

PHOENIX PIONEER TECHNOLOGY CO LTD0 citations41
US10278282B2Apr 30, 2019

Substrate structure and manufacturing method thereof

PHOENIX PIONEER TECHNOLOGY CO LTD0 citations40
US10347575B2Jul 9, 2019

Package substrate and its fabrication method

PHOENIX PIONEER TECHNOLOGY CO LTD0 citations37

ACER INC

3 patents

HTC CORP

2 patents

CHEN DONG-SEN

2 patents

ADVANCED SEMICONDUCTOR ENG

1 patent

DELTA ELECTRONICS INC

1 patent