Inventor
YU CHUN-HSIEN
TW28 patents
⚠️ This page may combine multiple inventors who share the name “YU CHUN-HSIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PHOENIX PIONEER TECHNOLOGY CO LTD
19 patentsUS11749612B2Sep 5, 2023
Semiconductor package device
PHOENIX PIONEER TECHNOLOGY CO LTD3 citations72
US9754982B2Sep 5, 2017
Packaging module and substrate structure thereof
PHOENIX PIONEER TECHNOLOGY CO LTD5 citations72
US11476204B2Oct 18, 2022
Flip-chip packaging substrate and method for fabricating the same
PHOENIX PIONEER TECHNOLOGY CO LTD2 citations71
US12094922B2Sep 17, 2024
Inductance traces protected through shielding layers
PHOENIX PIONEER TECHNOLOGY CO LTD0 citations62
US11404348B2Aug 2, 2022
Semiconductor package carrier board, method for fabricating the same, and electronic package having the same
PHOENIX PIONEER TECHNOLOGY CO LTD0 citations62
US11335630B2May 17, 2022
Semiconductor package substrate, electronic package and methods for fabricating the same
PHOENIX PIONEER TECHNOLOGY CO LTD0 citations62
US11183447B2Nov 23, 2021
Flip-chip package substrate and method for fabricating the same
PHOENIX PIONEER TECHNOLOGY CO LTD1 citations62
US12154866B2Nov 26, 2024
Method of fabricating a flip-chip package core substrate with build-up layers
PHOENIX PIONEER TECHNOLOGY CO LTD0 citations61
US9824964B2Nov 21, 2017
Package substrate, package structure including the same, and their fabrication methods
PHOENIX PIONEER TECHNOLOGY CO LTD1 citations52
US9711445B2Jul 18, 2017
Package substrate, package structure including the same, and their fabrication methods
PHOENIX PIONEER TECHNOLOGY CO LTD1 citations52
US11508673B2Nov 22, 2022
Semiconductor packaging substrate, fabrication method and packaging process thereof
PHOENIX PIONEER TECHNOLOGY CO LTD0 citations51
US11450597B2Sep 20, 2022
Semiconductor package substrate having heat dissipating metal sheet on solder pads, method for fabricating the same, and electronic package having the same
PHOENIX PIONEER TECHNOLOGY CO LTD0 citations51
US11139230B2Oct 5, 2021
Flip-chip package substrate and method for preparing the same
PHOENIX PIONEER TECHNOLOGY CO LTD0 citations51
US10366906B2Jul 30, 2019
Electronic package and its package substrate
PHOENIX PIONEER TECHNOLOGY CO LTD0 citations51
US9852977B2Dec 26, 2017
Package substrate
PHOENIX PIONEER TECHNOLOGY CO LTD0 citations51
US11646331B2May 9, 2023
Package substrate
PHOENIX PIONEER TECHNOLOGY CO LTD0 citations50
US10745818B2Aug 18, 2020
Method of fabricating package substrates
PHOENIX PIONEER TECHNOLOGY CO LTD0 citations41
US10278282B2Apr 30, 2019
Substrate structure and manufacturing method thereof
PHOENIX PIONEER TECHNOLOGY CO LTD0 citations40
US10347575B2Jul 9, 2019
Package substrate and its fabrication method
PHOENIX PIONEER TECHNOLOGY CO LTD0 citations37
ACER INC
3 patentsHTC CORP
2 patentsUS11238374B2Feb 1, 2022
Method for verifying training data, training system, and computer readable medium
HTC CORP4 citations68
US11379722B2Jul 5, 2022
Method for training generative adversarial network (GAN), method for generating images by using GAN, and computer readable storage medium
HTC CORP1 citations61