P

Inventor

MORIWAKI TAKAYUKI

JP8 patents
⚠️ This page may combine multiple inventors who share the name “MORIWAKI TAKAYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CANON ANELVA CORP

3 patents
US11600469B2Mar 7, 2023

Plasma processing apparatus

CANON ANELVA CORP5 citations84
US11784030B2Oct 10, 2023

Plasma processing apparatus

CANON ANELVA CORP4 citations73
US11916038B2Feb 27, 2024

Chemical bonding method, package-type electronic component, and hybrid bonding method for electronic device

CANON ANELVA CORP0 citations60

UNIV TOHOKU

3 patents
US12583204B2Mar 24, 2026

Method for atomic diffusion bonding and bonded structure

UNIV TOHOKU0 citations59
US12451461B2Oct 21, 2025

Chemical bonding method and joined structure

UNIV TOHOKU0 citations59
US11450643B2Sep 20, 2022

Chemical bonding method and joined structure

UNIV TOHOKU0 citations59

PANASONIC IP MAN CO LTD

1 patent
US11505040B2Nov 22, 2022

Vehicle

PANASONIC IP MAN CO LTD2 citations71

HITACHI METALS LTD

1 patent
US7744706B2Jun 29, 2010

Solder alloy for bonding oxide material, and solder joint using the same

HITACHI METALS LTD0 citations50