Inventor
PON FLORENCE
US15 patents
⚠️ This page may combine multiple inventors who share the name “PON FLORENCE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
13 patentsUS11036370B2Jun 15, 2021
Computer-assisted or autonomous driving vehicles social network
INTEL CORP8 citations82
US10332899B2Jun 25, 2019
3D package having edge-aligned die stack with direct inter-die wire connections
INTEL CORP3 citations72
US11704007B2Jul 18, 2023
Computer-assisted or autonomous driving vehicles social network
INTEL CORP1 citations71
US11658079B2May 23, 2023
Temporary interconnect for use in testing a semiconductor package
INTEL CORP0 citations62
US11545464B2Jan 3, 2023
Diode for use in testing semiconductor packages
INTEL CORP1 citations62
US11652031B2May 16, 2023
Shrinkable package assembly
INTEL CORP0 citations61
US11599750B2Mar 7, 2023
Edge devices utilizing personalized machine learning and methods of operating the same
INTEL CORP1 citations61
US12340077B2Jun 24, 2025
Computer-assisted or autonomous driving vehicles social network
INTEL CORP0 citations60
US11495547B2Nov 8, 2022
Fiber reinforced stiffener
INTEL CORP0 citations57
US11399434B2Jul 26, 2022
Electronic package and method of forming an electronic package
INTEL CORP1 citations57
US12347784B2Jul 1, 2025
Interposer with step feature
INTEL CORP0 citations51
US10573575B2Feb 25, 2020
Semiconductor package with thermal fins
INTEL CORP0 citations49
US11948917B2Apr 2, 2024
Die over mold stacked semiconductor package
INTEL CORP0 citations48