Inventor
CAI YUHONG
US13 patents
⚠️ This page may combine multiple inventors who share the name “CAI YUHONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
11 patentsUS10192840B2Jan 29, 2019
Ball pad with a plurality of lobes
INTEL CORP2 citations70
US10051763B2Aug 14, 2018
Local stress-relieving devices, systems, and methods for electronic assemblies
INTEL CORP2 citations63
US11476174B2Oct 18, 2022
Solder mask design for delamination prevention
INTEL CORP0 citations62
US11894334B2Feb 6, 2024
Dual head capillary design for vertical wire bond
INTEL CORP0 citations61
US11569144B2Jan 31, 2023
Semiconductor package design for solder joint reliability
INTEL CORP0 citations61
US11848292B2Dec 19, 2023
Pad design for thermal fatigue resistance and interconnect joint reliability
INTEL CORP0 citations60
US11694976B2Jul 4, 2023
Bowl shaped pad
INTEL CORP0 citations60
US12068283B2Aug 20, 2024
Die stack with cascade and vertical connections
INTEL CORP0 citations59
US11171114B2Nov 9, 2021
Die stack with cascade and vertical connections
INTEL CORP0 citations59
US10573575B2Feb 25, 2020
Semiconductor package with thermal fins
INTEL CORP0 citations49
US11948917B2Apr 2, 2024
Die over mold stacked semiconductor package
INTEL CORP0 citations48