P

Inventor

KIM HYOUNG IL

US56 patents
⚠️ This page may combine multiple inventors who share the name “KIM HYOUNG IL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

25 patents
US10393799B2Aug 27, 2019

Electronic device package

INTEL CORP10 citations84
US11990449B2May 21, 2024

Dual RDL stacked die package using vertical wire

INTEL CORP6 citations75
US10120424B2Nov 6, 2018

Conductive stress-relief washers in microelectronic assemblies

INTEL CORP4 citations73
US11145632B2Oct 12, 2021

High density die package configuration on system boards

INTEL CORP3 citations68
US11658079B2May 23, 2023

Temporary interconnect for use in testing a semiconductor package

INTEL CORP0 citations62
US11637045B2Apr 25, 2023

Anisotropic conductive film (ACF) for use in testing semiconductor packages

INTEL CORP0 citations62
US11545464B2Jan 3, 2023

Diode for use in testing semiconductor packages

INTEL CORP1 citations62
US11251111B2Feb 15, 2022

Leadframe in packages of integrated circuits

INTEL CORP1 citations62
US10892248B2Jan 12, 2021

Multi-stacked die package with flexible interconnect

INTEL CORP0 citations62
US10727220B2Jul 28, 2020

Package on package with integrated passive electronics method and apparatus

INTEL CORP1 citations62
US10181456B2Jan 15, 2019

Multi-package integrated circuit assembly with package on package interconnects

INTEL CORP1 citations62
US12046581B2Jul 23, 2024

Integrated circuit package with glass spacer

INTEL CORP0 citations60
US11393788B2Jul 19, 2022

Integrated circuit package with glass spacer

INTEL CORP0 citations60
US11749653B2Sep 5, 2023

Multi-die, vertical-wire package-in-package apparatus, and methods of making same

INTEL CORP0 citations59
US10847450B2Nov 24, 2020

Compact wirebonding in stacked-chip system in package, and methods of making same

INTEL CORP1 citations59
US11694987B2Jul 4, 2023

Active package substrate having anisotropic conductive layer

INTEL CORP0 citations57
US10790257B2Sep 29, 2020

Active package substrate having anisotropic conductive layer

INTEL CORP1 citations57
US11211314B2Dec 28, 2021

Interposer for electrically connecting stacked integrated circuit device packages

INTEL CORP0 citations52
US10446533B2Oct 15, 2019

Package on package with integrated passive electronics method and apparatus

INTEL CORP0 citations52
US11830848B2Nov 28, 2023

Electronic device package

INTEL CORP0 citations51
US11817438B2Nov 14, 2023

System in package with interconnected modules

INTEL CORP0 citations51
US10573575B2Feb 25, 2020

Semiconductor package with thermal fins

INTEL CORP0 citations49
US11948917B2Apr 2, 2024

Die over mold stacked semiconductor package

INTEL CORP0 citations48
US10497669B2Dec 3, 2019

Hybrid die stacking

INTEL CORP0 citations47
US10777486B2Sep 15, 2020

Substrate-free system in package design

INTEL CORP0 citations42

SAMSUNG ELECTRONICS CO LTD

16 patents
US9071699B2Jun 30, 2015

Apparatus and method for automatic call receiving and sending depending on user posture in portable terminal

SAMSUNG ELECTRONICS CO LTD4 citations84
US7478894B2Jan 20, 2009

Method of calibrating print alignment error

SAMSUNG ELECTRONICS CO LTD20 citations83
US6984956B2Jan 10, 2006

Method of driving step motor

SAMSUNG ELECTRONICS CO LTD12 citations83
US10425524B2Sep 24, 2019

Apparatus and method for automatic call receiving and sending depending on user posture in portable terminal

SAMSUNG ELECTRONICS CO LTD2 citations73
US10373545B2Aug 6, 2019

Frame rate control method and electronic device thereof

SAMSUNG ELECTRONICS CO LTD2 citations73
US10038776B2Jul 31, 2018

Apparatus and method for automatic call receiving and sending depending on user posture in portable terminal

SAMSUNG ELECTRONICS CO LTD2 citations73
US7262786B2Aug 28, 2007

Image aligning method for thermal imaging printer

SAMSUNG ELECTRONICS CO LTD7 citations73
US7083251B2Aug 1, 2006

Method of compensating sheet feeding errors in ink-jet printer

SAMSUNG ELECTRONICS CO LTD9 citations73
US10217435B2Feb 26, 2019

Electronic device for displaying screen and method of controlling same

SAMSUNG ELECTRONICS CO LTD2 citations72
US9503002B2Nov 22, 2016

Image forming apparatus, motor control apparatus, and method of controlling motor

SAMSUNG ELECTRONICS CO LTD2 citations61
US7417657B2Aug 26, 2008

Thermal printer and printing method

SAMSUNG ELECTRONICS CO LTD3 citations58
US10863017B2Dec 8, 2020

Apparatus and method for automatic call receiving and sending depending on user posture in portable terminal

SAMSUNG ELECTRONICS CO LTD0 citations52
US9864443B2Jan 9, 2018

Method for controlling user input and electronic device thereof

SAMSUNG ELECTRONICS CO LTD1 citations52
US9521242B2Dec 13, 2016

Apparatus and method for automatic call receiving and sending depending on user posture in portable terminal

SAMSUNG ELECTRONICS CO LTD0 citations52
US9360804B2Jun 7, 2016

Image forming apparatus and control method thereof

SAMSUNG ELECTRONICS CO LTD0 citations52
US7348770B2Mar 25, 2008

Electronic device for interrupt signal control to acquire encoder speed information and a method thereof

SAMSUNG ELECTRONICS CO LTD0 citations52

KIM HYOUNG-IL

5 patents

KIM BO-MIN

1 patent

KIM HYOUNG IL

1 patent

KIM TAE-YOUNG

1 patent

S PRINTING SOLUTION CO LTD

1 patent

Showing the top 50 of 56 patents by PatentIndex Score.