Inventor
KIM HYOUNG IL
US56 patents
⚠️ This page may combine multiple inventors who share the name “KIM HYOUNG IL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
25 patentsUS10393799B2Aug 27, 2019
Electronic device package
INTEL CORP10 citations84
US11990449B2May 21, 2024
Dual RDL stacked die package using vertical wire
INTEL CORP6 citations75
US10120424B2Nov 6, 2018
Conductive stress-relief washers in microelectronic assemblies
INTEL CORP4 citations73
US11145632B2Oct 12, 2021
High density die package configuration on system boards
INTEL CORP3 citations68
US11658079B2May 23, 2023
Temporary interconnect for use in testing a semiconductor package
INTEL CORP0 citations62
US11637045B2Apr 25, 2023
Anisotropic conductive film (ACF) for use in testing semiconductor packages
INTEL CORP0 citations62
US11545464B2Jan 3, 2023
Diode for use in testing semiconductor packages
INTEL CORP1 citations62
US11251111B2Feb 15, 2022
Leadframe in packages of integrated circuits
INTEL CORP1 citations62
US10892248B2Jan 12, 2021
Multi-stacked die package with flexible interconnect
INTEL CORP0 citations62
US10727220B2Jul 28, 2020
Package on package with integrated passive electronics method and apparatus
INTEL CORP1 citations62
US10181456B2Jan 15, 2019
Multi-package integrated circuit assembly with package on package interconnects
INTEL CORP1 citations62
US12046581B2Jul 23, 2024
Integrated circuit package with glass spacer
INTEL CORP0 citations60
US11393788B2Jul 19, 2022
Integrated circuit package with glass spacer
INTEL CORP0 citations60
US11749653B2Sep 5, 2023
Multi-die, vertical-wire package-in-package apparatus, and methods of making same
INTEL CORP0 citations59
US10847450B2Nov 24, 2020
Compact wirebonding in stacked-chip system in package, and methods of making same
INTEL CORP1 citations59
US11694987B2Jul 4, 2023
Active package substrate having anisotropic conductive layer
INTEL CORP0 citations57
US10790257B2Sep 29, 2020
Active package substrate having anisotropic conductive layer
INTEL CORP1 citations57
US11211314B2Dec 28, 2021
Interposer for electrically connecting stacked integrated circuit device packages
INTEL CORP0 citations52
US10446533B2Oct 15, 2019
Package on package with integrated passive electronics method and apparatus
INTEL CORP0 citations52
US11830848B2Nov 28, 2023
Electronic device package
INTEL CORP0 citations51
US11817438B2Nov 14, 2023
System in package with interconnected modules
INTEL CORP0 citations51
US10573575B2Feb 25, 2020
Semiconductor package with thermal fins
INTEL CORP0 citations49
US11948917B2Apr 2, 2024
Die over mold stacked semiconductor package
INTEL CORP0 citations48
US10497669B2Dec 3, 2019
Hybrid die stacking
INTEL CORP0 citations47
US10777486B2Sep 15, 2020
Substrate-free system in package design
INTEL CORP0 citations42
SAMSUNG ELECTRONICS CO LTD
16 patentsUS9071699B2Jun 30, 2015
Apparatus and method for automatic call receiving and sending depending on user posture in portable terminal
SAMSUNG ELECTRONICS CO LTD4 citations84
US7478894B2Jan 20, 2009
Method of calibrating print alignment error
SAMSUNG ELECTRONICS CO LTD20 citations83
US6984956B2Jan 10, 2006
Method of driving step motor
SAMSUNG ELECTRONICS CO LTD12 citations83
US10425524B2Sep 24, 2019
Apparatus and method for automatic call receiving and sending depending on user posture in portable terminal
SAMSUNG ELECTRONICS CO LTD2 citations73
US10373545B2Aug 6, 2019
Frame rate control method and electronic device thereof
SAMSUNG ELECTRONICS CO LTD2 citations73
US10038776B2Jul 31, 2018
Apparatus and method for automatic call receiving and sending depending on user posture in portable terminal
SAMSUNG ELECTRONICS CO LTD2 citations73
US7262786B2Aug 28, 2007
Image aligning method for thermal imaging printer
SAMSUNG ELECTRONICS CO LTD7 citations73
US7083251B2Aug 1, 2006
Method of compensating sheet feeding errors in ink-jet printer
SAMSUNG ELECTRONICS CO LTD9 citations73
US10217435B2Feb 26, 2019
Electronic device for displaying screen and method of controlling same
SAMSUNG ELECTRONICS CO LTD2 citations72
US9503002B2Nov 22, 2016
Image forming apparatus, motor control apparatus, and method of controlling motor
SAMSUNG ELECTRONICS CO LTD2 citations61
US7417657B2Aug 26, 2008
Thermal printer and printing method
SAMSUNG ELECTRONICS CO LTD3 citations58
US10863017B2Dec 8, 2020
Apparatus and method for automatic call receiving and sending depending on user posture in portable terminal
SAMSUNG ELECTRONICS CO LTD0 citations52
US9864443B2Jan 9, 2018
Method for controlling user input and electronic device thereof
SAMSUNG ELECTRONICS CO LTD1 citations52
US9521242B2Dec 13, 2016
Apparatus and method for automatic call receiving and sending depending on user posture in portable terminal
SAMSUNG ELECTRONICS CO LTD0 citations52
US9360804B2Jun 7, 2016
Image forming apparatus and control method thereof
SAMSUNG ELECTRONICS CO LTD0 citations52
US7348770B2Mar 25, 2008
Electronic device for interrupt signal control to acquire encoder speed information and a method thereof
SAMSUNG ELECTRONICS CO LTD0 citations52
KIM HYOUNG-IL
5 patentsUS9292191B2Mar 22, 2016
Apparatus and method for determining user input pattern in portable terminal
KIM HYOUNG-IL9 citations83
US8768325B2Jul 1, 2014
Apparatus and method for automatic call receiving and sending depending on user posture in portable terminal
KIM HYOUNG-IL6 citations83
US8773726B2Jul 8, 2014
Image forming device capable of controlling scanning unit and method to control scanning unit thereof
KIM HYOUNG-IL2 citations62
US8598830B2Dec 3, 2013
Image forming apparatus, motor control apparatus and motor control method thereof
KIM HYOUNG-IL2 citations60
US8226196B2Jul 24, 2012
Image forming apparatus, image forming method and computer readable medium recorded with a program executing the image forming method
KIM HYOUNG-IL0 citations51
KIM BO-MIN
1 patentKIM HYOUNG IL
1 patentKIM TAE-YOUNG
1 patentS PRINTING SOLUTION CO LTD
1 patentShowing the top 50 of 56 patents by PatentIndex Score.