Inventor
GROOTHUIS STEVEN K
US22 patents
⚠️ This page may combine multiple inventors who share the name “GROOTHUIS STEVEN K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
18 patentsUS10978427B2Apr 13, 2021
Stacked semiconductor die assemblies with partitioned logic and associated systems and methods
MICRON TECHNOLOGY INC39 citations94
US9780079B2Oct 3, 2017
Semiconductor die assembly and methods of forming thermal paths
MICRON TECHNOLOGY INC19 citations92
US9287240B2Mar 15, 2016
Stacked semiconductor die assemblies with thermal spacers and associated systems and methods
MICRON TECHNOLOGY INC21 citations92
US9691746B2Jun 27, 2017
Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths
MICRON TECHNOLOGY INC9 citations84
US10816275B2Oct 27, 2020
Semiconductor device assembly with vapor chamber
MICRON TECHNOLOGY INC1 citations73
US10741468B2Aug 11, 2020
Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods
MICRON TECHNOLOGY INC1 citations73
US10551129B2Feb 4, 2020
Semiconductor device assembly with vapor chamber
MICRON TECHNOLOGY INC3 citations73
US10215500B2Feb 26, 2019
Semiconductor device assembly with vapor chamber
MICRON TECHNOLOGY INC3 citations73
US10170389B2Jan 1, 2019
Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods
MICRON TECHNOLOGY INC3 citations73
US7183485B2Feb 27, 2007
Microelectronic component assemblies having lead frames adapted to reduce package bow
MICRON TECHNOLOGY INC9 citations68
US9443744B2Sep 13, 2016
Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods
MICRON TECHNOLOGY INC2 citations63
US11776877B2Oct 3, 2023
Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths
MICRON TECHNOLOGY INC0 citations62
US11594462B2Feb 28, 2023
Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods
MICRON TECHNOLOGY INC0 citations62
US11562986B2Jan 24, 2023
Stacked semiconductor die assemblies with partitioned logic and associated systems and methods
MICRON TECHNOLOGY INC0 citations62
US10163755B2Dec 25, 2018
Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths
MICRON TECHNOLOGY INC1 citations52
US9837396B2Dec 5, 2017
Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods
MICRON TECHNOLOGY INC0 citations52
US9818625B2Nov 14, 2017
Stacked semiconductor die assemblies with thermal spacers and associated systems and methods
MICRON TECHNOLOGY INC1 citations52
US7601562B2Oct 13, 2009
Microelectronic component assemblies having lead frames adapted to reduce package bow
MICRON TECHNOLOGY INC0 citations46
TEXAS INSTRUMENTS INC
3 patentsUS5581489ADec 3, 1996
Model generator for constructing and method of generating a model of an object for finite element analysis
TEXAS INSTRUMENTS INC42 citations90
US6192709B1Feb 27, 2001
Quencher clamping operation using an electromagnet
TEXAS INSTRUMENTS INC0 citations51
US5950069ASep 7, 1999
Quencher clamping operation using an electromagnet
TEXAS INSTRUMENTS INC1 citations51