Inventor

MIYAZAWA YOSUKE

JP2 patents

Patents

2 patents

US11121114B2Sep 14, 2021

Wire bonding tool including a wedge tool

FUJI ELECTRIC CO LTD6 citations66

US9595491B2Mar 14, 2017

Apparatus for manufacturing semiconductor device and the semiconductor device

FUJI ELECTRIC CO LTD0 citations45