Inventor
KANG UNBYOUNG
KR22 patents
Patents
22 patentsUS11289438B2Mar 29, 2022
Die-to-wafer bonding structure and semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD5 citations82
US12218102B2Feb 4, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD3 citations71
US11658141B2May 23, 2023
Die-to-wafer bonding structure and semiconductor package using the same
SAMSUNG ELECTRONICS CO LTD3 citations71
US12176313B2Dec 24, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations69
US11705323B2Jul 18, 2023
Wafer trimming device
SAMSUNG ELECTRONICS CO LTD2 citations67
US11967581B2Apr 23, 2024
Package structures having underfills
SAMSUNG ELECTRONICS CO LTD0 citations62
US11587906B2Feb 21, 2023
Package structures having underfills
SAMSUNG ELECTRONICS CO LTD0 citations62
US12027482B2Jul 2, 2024
Semiconductor chip having a through electrode and semiconductor package including the semiconductor chip
SAMSUNG ELECTRONICS CO LTD0 citations61
US11569145B2Jan 31, 2023
Semiconductor package with thermal interface material for improving package reliability
SAMSUNG ELECTRONICS CO LTD1 citations61
US12199056B2Jan 14, 2025
Semiconductor device, semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11935832B2Mar 19, 2024
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11469180B2Oct 11, 2022
Semiconductor device including an insulating material layer with concave-convex portions
SAMSUNG ELECTRONICS CO LTD1 citations60
US11791308B2Oct 17, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US11362062B2Jun 14, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US12451474B2Oct 21, 2025
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12394641B2Aug 19, 2025
Molding apparatus of semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US12355004B2Jul 8, 2025
Semiconductor chip and semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US12400990B2Aug 26, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations49
US12444703B2Oct 14, 2025
Manufacturing method of semiconductor chip
SAMSUNG ELECTRONICS CO LTD0 citations47
US12218086B2Feb 4, 2025
Semiconductor package and method of manufacturing same
SAMSUNG ELECTRONICS CO LTD0 citations47
US11688707B2Jun 27, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations47
US12218096B2Feb 4, 2025
Semiconductor package and method of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations46