Inventor

LEE JONGHO

KR95 patents

⚠️ This page may combine multiple inventors who share the name “LEE JONGHO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE JONGHO

SAMSUNG ELECTRONICS CO LTD

Dielectric layer for semiconductor device and method of manufacturing the same

Dielectric layer for semiconductor device and method of manufacturing the same

Semiconductor package and method of fabricating the same

Semiconductor package and method for manufacturing the same

Bonding head and method for bonding semiconductor package, and semiconductor package

Semiconductor devices and semiconductor packages including the same

Semiconductor package having dummy pads and method of manufacturing semiconductor package having dummy pads

Semiconductor device

Semiconductor device

Semiconductor packages and methods of forming the same

Semiconductor package

Semiconductor package and method of fabricating the same

Methods of inspection of semiconductor packages including measurement of alignment accuracy among semiconductor chips

Semiconductor packages with chips partially embedded in adhesive

Semiconductor packages including stacked substrates and penetration electrodes

Semiconductor package and method for fabricating the same

Semiconductor module adapted to be inserted into connector of external device

Semiconductor package and method of manufacturing semiconductor package

Packaged multi-chip semiconductor devices and methods of fabricating same

Semiconductor devices and semiconductor packages including the same

Semiconductor package and method of manufacture

Package structures having underfills

Semiconductor devices and semiconductor packages including the same

Semiconductor device

Semiconductor package and method of manufacture

Package structures having underfills

Packaged multi-chip semiconductor devices and methods of fabricating same

Semiconductor package for discharging heat generated by semiconductor chip

Semiconductor device

Semiconductor package for discharging heat generated by semiconductor chip

LG ELECTRONICS INC

Cooking device

Cooking device

Cooking device

Cooking device

LEE JONGHO

Cooker

Semiconductor devices and methods for fabricating the same

GWANGJU INST SCIENCE & TECH

Stretchable substrate, stretchable photovoltaic apparatus, and stretchable device

Micro-light emitting device array contacting skin, method for fabricating the same, and charging system for living-body implantable electronic device

KIM YOUNG LYONG

Semiconductor packages and methods of forming the same

Semiconductor package and method of fabricating the same

HYUNDAI MOTOR CO LTD

Engine having coolant control valve

Coolant control valve that selectively supplies EGR cooler with coolant

KAKEI SHINJI

Quantitative motor function evaluation system

LIM HWAN-SIK

Semiconductor package and method for fabricating the same

LG DISPLAY CO LTD

Organic light emitting display

KOREA INST SCI & TECH

Method for manufacturing homogeneous green bodies from the powders of multimodal particle size distribution using centrifugal casting

KARNIK ROHIT N

Liquid filtration using pressure difference across a hydrophobic membrane

UNIV PENNSYLVANIA

Background-suppressed myelin water imaging

WISCONSIN ALUMNI RES FOUND

Systems, methods, and media for stochastic exposure coding that mitigates multi-camera interference in continuous wave time-of-flight imaging

KIA MOTORS CORP

Apparatus and method for manufacturing vehicle door trim and vehicle door trim manufactured using the method