Inventor
LEE TEAKHOON
KR13 patents
⚠️ This page may combine multiple inventors who share the name “LEE TEAKHOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
12 patentsUS11462462B2Oct 4, 2022
Semiconductor packages including a recessed conductive post
SAMSUNG ELECTRONICS CO LTD3 citations71
US12176313B2Dec 24, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations69
US11705323B2Jul 18, 2023
Wafer trimming device
SAMSUNG ELECTRONICS CO LTD2 citations67
US12237240B2Feb 25, 2025
Semiconductor package and method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11967581B2Apr 23, 2024
Package structures having underfills
SAMSUNG ELECTRONICS CO LTD0 citations62
US11587906B2Feb 21, 2023
Package structures having underfills
SAMSUNG ELECTRONICS CO LTD0 citations62
US11791308B2Oct 17, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US11362062B2Jun 14, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations59
US12355004B2Jul 8, 2025
Semiconductor chip and semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US11923340B2Mar 5, 2024
Semiconductor package including mold layer and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD0 citations50
US11791282B2Oct 17, 2023
Semiconductor package including part of underfill on portion of a molding material surrounding sides of logic chip and memory stack on interposer and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations49
US12218096B2Feb 4, 2025
Semiconductor package and method of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations46