Inventor
KUO CHIA-PANG
TW16 patents
⚠️ This page may combine multiple inventors who share the name “KUO CHIA-PANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
14 patentsUS11676898B2Jun 13, 2023
Diffusion barrier for semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US11398406B2Jul 26, 2022
Selective deposition of metal barrier in damascene processes
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations70
US11527476B2Dec 13, 2022
Interconnect structure of semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11183424B2Nov 23, 2021
Barrier layer formation for conductive feature
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11043416B2Jun 22, 2021
Gradient atomic layer deposition
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11043413B2Jun 22, 2021
Barrier layer formation for conductive feature
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12354958B2Jul 8, 2025
Semiconductor devices and methods of formation
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US12322649B2Jun 3, 2025
Interconnect structure of semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12315809B2May 27, 2025
Via for semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12068194B2Aug 20, 2024
Selective deposition of metal barrier in damascene processes
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11837500B2Dec 5, 2023
Selective deposition of metal barrier in damascene processes and the structures formed thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11810857B2Nov 7, 2023
Via for semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US10741442B2Aug 11, 2020
Barrier layer formation for conductive feature
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10672652B2Jun 2, 2020
Gradient atomic layer deposition
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51