Inventor

AN JIN HO

KR40 patents

⚠️ This page may combine multiple inventors who share the name “AN JIN HO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

AN JIN HO

SAMSUNG ELECTRONICS CO LTD

Method of fabricating multi-substrate semiconductor devices

Integrated circuit devices having through-silicon via structures and methods of manufacturing the same

Semiconductor devices and methods of fabricating the same

Semiconductor devices and semiconductor packages including the same

Semiconductor devices including through-silicon via

Semiconductor packages having first and second redistribution patterns

Semiconductor package

Semiconductor device

Semiconductor device

Semiconductor devices and semiconductor packages including the same, and methods of manufacturing the semiconductor devices

Semiconductor devices including a through via structure and methods of forming the same

Semiconductor devices and methods of manufacturing the same, and semiconductor packages including the semiconductor devices

Method of manufacturing a semiconductor device

Semiconductor packages

Semiconductor devices and semiconductor packages including the same

Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devices

Semiconductor devices and semiconductor packages including the same

Semiconductor device

Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devices

Semiconductor devices having through silicon vias and methods of fabricating the same

Semiconductor devices having through electrodes

Semiconductor package and method of fabricating the same

Interconnection structure and semiconductor package including the same

Semiconductor device

Interconnection structure and semiconductor package including the same

Semiconductor package including fine redistribution patterns

Interconnection structure and semiconductor package including the same

Interconnection structure and semiconductor package including the same

Semiconductor device

Semiconductor device and method of fabricating the same

Semiconductor package

Semiconductor package device

Interconnection structure and semiconductor package including the same

Semiconductor packages including an insulating layer including a recessed surface and methods of manufacturing the same

LEE HO-JIN

Semiconductor device including conductive via with buffer layer at tapered portion of conductive via

Semiconductor devices with through electrodes and methods of fabricating the same

JUNG DEOK-YOUNG

Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same

Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same

KIM TAEYEONG

Semiconductor devices having stacked structures and methods for fabricating the same

KANG PIL-KYU

Semiconductor devices having through-electrodes and methods for fabricating the same