Inventor
FUJISAKI ATSUSHI
KR28 patents
⚠️ This page may combine multiple inventors who share the name “FUJISAKI ATSUSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
26 patentsUS10325869B2Jun 18, 2019
Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices
SAMSUNG ELECTRONICS CO LTD6 citations84
US9728490B2Aug 8, 2017
Semiconductor devices and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD9 citations83
US11302660B2Apr 12, 2022
Semiconductor devices and semiconductor packages including the same
SAMSUNG ELECTRONICS CO LTD1 citations73
US11742271B2Aug 29, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD4 citations72
US11004814B2May 11, 2021
Semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations72
US10580726B2Mar 3, 2020
Semiconductor devices and semiconductor packages including the same, and methods of manufacturing the semiconductor devices
SAMSUNG ELECTRONICS CO LTD3 citations72
US11538783B2Dec 27, 2022
Semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations70
US12040294B2Jul 16, 2024
Semiconductor devices and semiconductor packages including the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US12014972B2Jun 18, 2024
Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations62
US11728297B2Aug 15, 2023
Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations62
US11694978B2Jul 4, 2023
Semiconductor devices and semiconductor packages including the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11094612B2Aug 17, 2021
Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations62
US11018101B2May 25, 2021
Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations62
US12424572B2Sep 23, 2025
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations61
US11581279B2Feb 14, 2023
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations61
US11488860B2Nov 1, 2022
Integrated circuit device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US10763163B2Sep 1, 2020
Integrated circuit device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US12354987B2Jul 8, 2025
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations59
US11984420B2May 14, 2024
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations59
US12381130B2Aug 5, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US12355005B2Jul 8, 2025
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12183664B2Dec 31, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US11444014B2Sep 13, 2022
Semiconductor packages including an insulating layer including a recessed surface and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US10020273B2Jul 10, 2018
Semiconductor devices and methods of forming the same
SAMSUNG ELECTRONICS CO LTD1 citations50
US12142541B2Nov 12, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations49
US10872869B2Dec 22, 2020
Semiconductor devices and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations39