Inventor
KUO CHUNG-HSING
TW13 patents
⚠️ This page may combine multiple inventors who share the name “KUO CHUNG-HSING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FORD GLOBAL TECH LLC
7 patentsUS9440555B2Sep 13, 2016
Battery pack thermal management
FORD GLOBAL TECH LLC12 citations82
US11912123B2Feb 27, 2024
Traction battery pack venting system and venting method
FORD GLOBAL TECH LLC2 citations71
US10199697B2Feb 5, 2019
Sealed battery pack designs
FORD GLOBAL TECH LLC6 citations71
US9738176B2Aug 22, 2017
Battery pack thermal management
FORD GLOBAL TECH LLC3 citations71
US12567624B2Mar 3, 2026
Thermal insulating joints for traction battery packs
FORD GLOBAL TECH LLC0 citations62
US10446887B2Oct 15, 2019
Battery thermal management system including thermal interface material with integrated heater element
FORD GLOBAL TECH LLC1 citations61
US10333118B2Jun 25, 2019
Electronics umbrella for electrified vehicle battery packs
FORD GLOBAL TECH LLC0 citations50
UNITED MICROELECTRONICS CORP
6 patentsUS11450633B2Sep 20, 2022
Package structure of semiconductor device with improved bonding between the substrates
UNITED MICROELECTRONICS CORP6 citations74
US11164822B1Nov 2, 2021
Structure of semiconductor device and method for bonding two substrates
UNITED MICROELECTRONICS CORP3 citations72
US10192808B1Jan 29, 2019
Semiconductor structure
UNITED MICROELECTRONICS CORP2 citations71
US12148723B2Nov 19, 2024
Structure of semiconductor device
UNITED MICROELECTRONICS CORP0 citations58
US11557558B2Jan 17, 2023
Structure of semiconductor device and method for bonding two substrates
UNITED MICROELECTRONICS CORP0 citations58
US11569188B2Jan 31, 2023
Semiconductor device including elongated bonding structure between the substrate
UNITED MICROELECTRONICS CORP0 citations50