Inventor
HIRASAWA TATSUO
JP10 patents
Patents
10 patentsUS10309005B2Jun 4, 2019
Deposition device and deposition method
TOKYO ELECTRON LTD3 citations72
US10189230B2Jan 29, 2019
Method for forming copper film
TOKYO ELECTRON LTD1 citations62
US11742190B2Aug 29, 2023
Sputtering apparatus and film forming method
TOKYO ELECTRON LTD0 citations60
US9406558B2Aug 2, 2016
Cu wiring fabrication method and storage medium
TOKYO ELECTRON LTD1 citations51
US12027353B2Jul 2, 2024
Substrate processing method and apparatus
TOKYO ELECTRON LTD0 citations50
US12014911B2Jun 18, 2024
Sputtering apparatus
TOKYO ELECTRON LTD0 citations50
US11479848B2Oct 25, 2022
Film forming apparatus and method
TOKYO ELECTRON LTD0 citations50
US11158492B2Oct 26, 2021
Film forming apparatus and film forming method
TOKYO ELECTRON LTD0 citations50
US9406557B2Aug 2, 2016
Copper wiring forming method with Ru liner and Cu alloy fill
TOKYO ELECTRON LTD0 citations39
US9253862B2Feb 2, 2016
Plasma processing method and plasma processing apparatus
TOKYO ELECTRON LTD0 citations38