Inventor
SEINO ATSURO
JP19 patents
⚠️ This page may combine multiple inventors who share the name “SEINO ATSURO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KOKUSAI ELECTRIC CORP
13 patentsUS12451360B2Oct 21, 2025
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12084757B2Sep 10, 2024
Method of manufacturing semiconductor device, substrate processing apparatus, method of processing substrate, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11967500B2Apr 23, 2024
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11915938B2Feb 27, 2024
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11538688B2Dec 27, 2022
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11424127B2Aug 23, 2022
Method of manufacturing semiconductor device, substrate processing apparatus, method of processing substrate, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12463031B2Nov 4, 2025
Method of processing substrate, recording medium, and substrate processing apparatus
KOKUSAI ELECTRIC CORP0 citations61
US12148621B2Nov 19, 2024
Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus
KOKUSAI ELECTRIC CORP0 citations61
US12084760B2Sep 10, 2024
Method of processing substrate, recording medium, substrate processing apparatus, and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations61
US11621169B2Apr 4, 2023
Method of manufacturing semiconductor device, recording medium, and substrate processing apparatus
KOKUSAI ELECTRIC CORP0 citations61
US12170206B2Dec 17, 2024
Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus
KOKUSAI ELECTRIC CORP0 citations57
US10734218B2Aug 4, 2020
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations51
US12421609B2Sep 23, 2025
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations50
HITACHI INT ELECTRIC INC
6 patentsUS9508555B2Nov 29, 2016
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC8 citations82
US10410870B2Sep 10, 2019
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC1 citations62
US9972500B2May 15, 2018
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC0 citations50
US9970107B2May 15, 2018
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC0 citations41
US9966268B2May 8, 2018
Method of manufacturing semiconductor device and substrate processing apparatus
HITACHI INT ELECTRIC INC0 citations41
US9653351B2May 16, 2017
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC0 citations41