Inventor
Lutker-Lee Katie
US20 patents
Patents
20 patentsUS10304725B2May 28, 2019
Manufacturing methods to protect ULK materials from damage during etch processing to obtain desired features
TOKYO ELECTRON LTD2 citations72
US9818610B2Nov 14, 2017
Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP)
TOKYO ELECTRON LTD4 citations70
US9607834B2Mar 28, 2017
Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP)
TOKYO ELECTRON LTD5 citations70
US12469701B2Nov 11, 2025
Patterning features with metal based resists
TOKYO ELECTRON LTD0 citations62
US12100591B2Sep 24, 2024
Photoactive metal-based hard mask integration
TOKYO ELECTRON LTD0 citations62
US12506005B2Dec 23, 2025
Methods and structures for increasing stability of soft or organic features
TOKYO ELECTRON LTD0 citations61
US12334391B2Jun 17, 2025
Method for patterning a substrate using photolithography
TOKYO ELECTRON LTD0 citations61
US11978631B2May 7, 2024
Forming contact holes with controlled local critical dimension uniformity
TOKYO ELECTRON LTD1 citations61
US11882776B2Jan 23, 2024
In-situ encapsulation of metal-insulator-metal (MIM) stacks for resistive random access memory (RERAM) cells
TOKYO ELECTRON LTD0 citations61
US12009211B2Jun 11, 2024
Method for highly anisotropic etching of titanium oxide spacer using selective top-deposition
TOKYO ELECTRON LTD0 citations58
US11837471B2Dec 5, 2023
Methods of patterning small features
TOKYO ELECTRON LTD1 citations57
US12581921B2Mar 17, 2026
Multiple patterning with selective mandrel formation
TOKYO ELECTRON LTD0 citations51
US12322597B2Jun 3, 2025
Pitch scaling in microfabrication
TOKYO ELECTRON LTD0 citations51
US11621164B2Apr 4, 2023
Method for critical dimension (CD) trim of an organic pattern used for multi-patterning purposes
TOKYO ELECTRON LTD0 citations51
US11410852B2Aug 9, 2022
Protective layers and methods of formation during plasma etching processes
TOKYO ELECTRON LTD0 citations51
US12438006B2Oct 7, 2025
Metal hard mask integration
TOKYO ELECTRON LTD0 citations50
US11756790B2Sep 12, 2023
Method for patterning a dielectric layer
TOKYO ELECTRON LTD0 citations50
US11361993B2Jun 14, 2022
Method for inverse via patterning for back end of line dual damascene structures
TOKYO ELECTRON LTD0 citations50
US12451354B2Oct 21, 2025
Double patterning method of patterning a substrate
TOKYO ELECTRON LTD0 citations48
US12451353B2Oct 21, 2025
Double hardmasks for self-aligned multi-patterning processes
TOKYO ELECTRON LTD0 citations45