Inventor
YE NING
CN80 patents
⚠️ This page may combine multiple inventors who share the name “YE NING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTRINSIC INNOVATION LLC
8 patentsUS11685047B2Jun 27, 2023
Skill template distribution for robotic demonstration learning
INTRINSIC INNOVATION LLC2 citations71
US12539605B2Feb 3, 2026
Robotic demonstration learning
INTRINSIC INNOVATION LLC0 citations61
US12296484B2May 13, 2025
Skill template distribution for robotic demonstration learning
INTRINSIC INNOVATION LLC0 citations61
US11820014B2Nov 21, 2023
Simulated local demonstration data for robotic demonstration learning
INTRINSIC INNOVATION LLC1 citations61
US11780086B2Oct 10, 2023
Robotic demonstration learning device
INTRINSIC INNOVATION LLC0 citations61
US11679497B2Jun 20, 2023
Distributed robotic demonstration learning
INTRINSIC INNOVATION LLC1 citations61
US11472025B2Oct 18, 2022
Robotic demonstration learning device
INTRINSIC INNOVATION LLC0 citations61
US12194625B2Jan 14, 2025
General fixture for robotic assembly processes
INTRINSIC INNOVATION LLC0 citations59
WESTERN DIGITAL TECH INC
7 patentsUS11393735B2Jul 19, 2022
Semiconductor device including reinforced corner supports
WESTERN DIGITAL TECH INC5 citations72
US11177242B2Nov 16, 2021
Semiconductor device including magnetic hold-down layer
WESTERN DIGITAL TECH INC0 citations62
US12033958B2Jul 9, 2024
Semiconductor device including a suspended reinforcing layer and method of manufacturing same
WESTERN DIGITAL TECH INC1 citations61
US11551991B2Jan 10, 2023
Semiconductor device package having cover portion with curved surface profile
WESTERN DIGITAL TECH INC0 citations61
US12154860B2Nov 26, 2024
Method of forming a semiconductor device including vertical contact fingers
WESTERN DIGITAL TECH INC0 citations60
US11978713B2May 7, 2024
Flip chip bump with multi-PI opening
WESTERN DIGITAL TECH INC0 citations60
US11961778B2Apr 16, 2024
Semiconductor device package having multi-layer molding compound and method
WESTERN DIGITAL TECH INC0 citations60
SANDISK CORP
5 patentsUS7778057B2Aug 17, 2010
PCB circuit modification from multiple to individual chip enable signals
SANDISK CORP16 citations91
US7772686B2Aug 10, 2010
Memory card fabricated using SiP/SMT hybrid technology
SANDISK CORP13 citations82
US7952179B2May 31, 2011
Semiconductor package having through holes for molding back side of package
SANDISK CORP2 citations62
US7611927B2Nov 3, 2009
Method of minimizing kerf width on a semiconductor substrate panel
SANDISK CORP4 citations62
US7709278B2May 4, 2010
Method of making PCB circuit modification from multiple to individual chip enable signals
SANDISK CORP4 citations61
SUZHOU YIHANG ELECTRONIC SCIENCE AND TECH CO LTD
5 patentsUSD1086021SJul 29, 2025
Battery charger housing
SUZHOU YIHANG ELECTRONIC SCIENCE AND TECH CO LTD8 citations83
USD1082664SJul 8, 2025
Battery charger housing
SUZHOU YIHANG ELECTRONIC SCIENCE AND TECH CO LTD4 citations74
USD1086994SAug 5, 2025
Charging station for electric vehicles
SUZHOU YIHANG ELECTRONIC SCIENCE AND TECH CO LTD3 citations72
USD1083789SJul 15, 2025
Battery charger
SUZHOU YIHANG ELECTRONIC SCIENCE AND TECH CO LTD4 citations72
USD1082663SJul 8, 2025
Battery charger housing
SUZHOU YIHANG ELECTRONIC SCIENCE AND TECH CO LTD0 citations62
SANDISK TECHNOLOGIES LLC
4 patentsUS9899347B1Feb 20, 2018
Wire bonded wide I/O semiconductor device
SANDISK TECHNOLOGIES LLC19 citations93
US10854573B2Dec 1, 2020
Semiconductor die singulation using a sacrificial bonding material layer and an anisotropic channel etch
SANDISK TECHNOLOGIES LLC14 citations84
US9761290B1Sep 12, 2017
Overheat prevention for annealing non-volatile memory
SANDISK TECHNOLOGIES LLC15 citations84
US10249592B2Apr 2, 2019
Wire bonded wide I/O semiconductor device
SANDISK TECHNOLOGIES LLC1 citations62
CITRIX SYSTEMS INC
4 patentsUS9736221B2Aug 15, 2017
Reverse seamless integration between local and remote computing environments
CITRIX SYSTEMS INC13 citations92
US8046695B2Oct 25, 2011
Methods and systems for incorporating at least one window from a first desktop environment having a first themed graphical display into a second desktop environment having a second themed graphical display
CITRIX SYSTEMS INC8 citations83
US10855747B2Dec 1, 2020
Reverse seamless integration between local and remote computing environments
CITRIX SYSTEMS INC2 citations73
US10200453B2Feb 5, 2019
Reverse seamless integration between local and remote computing environments
CITRIX SYSTEMS INC3 citations73
ASML NETHERLANDS BV
4 patentsUS11728131B2Aug 15, 2023
Thermal-aided inspection by advanced charge controller module in a charged particle system
ASML NETHERLANDS BV2 citations73
US12217927B2Feb 4, 2025
Beam manipulation of advanced charge controller module in a charged particle system
ASML NETHERLANDS BV0 citations62
US12125669B2Oct 22, 2024
Thermal-aided inspection by advanced charge controller module in a charged particle system
ASML NETHERLANDS BV0 citations62
US12469674B2Nov 11, 2025
Photo-electrical evolution defect inspection
ASML NETHERLANDS BV0 citations61
KESZLER DOUGLAS A
2 patentsFUJIAN INST RES STR MATTER CAS
2 patentsUS10858756B2Dec 8, 2020
Nonlinear optical crystal fluorine boron beryllium salt and its preparation process and use
FUJIAN INST RES STR MATTER CAS2 citations71
US11898267B2Feb 13, 2024
Nonlinear optical crystal fluorine boron beryllium salt and its preparation process and use
FUJIAN INST RES STR MATTER CAS0 citations60
MOMCHILOV GEORGY
1 patentGOOGLE LLC
1 patentMCCARTHY MICHAEL
1 patentJIANGSU YIHANG ELECTRIC TECH CO LTD
1 patentSANDISK SEMICONDUCTOR (SHANGHAI) CO LTD
1 patentYAN XIANGYUN
1 patentHARVARD COLLEGE
1 patentSANDISK INFORMATION TECH SHANGAHAI CO LTD
1 patentOREGON STATE
1 patentShowing the top 50 of 80 patents by PatentIndex Score.