Inventor
WANG CHEN-HSIAO
TW6 patents
Patents
6 patentsUS9502366B2Nov 22, 2016
Semiconductor structure with UBM layer and method of fabricating the same
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US12482777B2Nov 25, 2025
Copper pillar bump structure and method of manufacturing the same
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US11848660B2Dec 19, 2023
Surface acoustic wave device fabrication method
UNITED MICROELECTRONICS CORP0 citations59
US10340230B1Jul 2, 2019
Semiconductor chip
UNITED MICROELECTRONICS CORP1 citations55
US12387998B2Aug 12, 2025
QFN package and fabricating method of the same
UNITED MICROELECTRONICS CORP0 citations53
US11495510B2Nov 8, 2022
Semiconductor device package structure and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations45