Inventor
HO KAI-KUANG
TW21 patents
Patents
21 patentsUS6429532B1Aug 6, 2002
Pad design
UNITED MICROELECTRONICS CORP92 citations97
US6204562B1Mar 20, 2001
Wafer-level chip scale package
UNITED MICROELECTRONICS CORP162 citations97
US6043109AMar 28, 2000
Method of fabricating wafer-level package
UNITED MICROELECTRONICS CORP148 citations97
US7387950B1Jun 17, 2008
Method for forming a metal structure
UNITED MICROELECTRONICS CORP31 citations92
US7170167B2Jan 30, 2007
Method for manufacturing wafer level chip scale package structure
UNITED MICROELECTRONICS CORP8 citations73
US6545350B2Apr 8, 2003
Integrated circuit packages and the method for the same
UNITED MICROELECTRONICS CORP8 citations73
US9502366B2Nov 22, 2016
Semiconductor structure with UBM layer and method of fabricating the same
UNITED MICROELECTRONICS CORP3 citations68
US7649268B2Jan 19, 2010
Semiconductor wafer
UNITED MICROELECTRONICS CORP4 citations62
US7241678B2Jul 10, 2007
Integrated die bumping process
UNITED MICROELECTRONICS CORP3 citations62
US7211500B2May 1, 2007
Pre-process before cutting a wafer and method of cutting a wafer
UNITED MICROELECTRONICS CORP6 citations62
US7534653B2May 19, 2009
Chip packaging process
UNITED MICROELECTRONICS CORP4 citations61
US7268440B2Sep 11, 2007
Fabrication of semiconductor integrated circuit chips
UNITED MICROELECTRONICS CORP2 citations60
US12482777B2Nov 25, 2025
Copper pillar bump structure and method of manufacturing the same
UNITED MICROELECTRONICS CORP0 citations59
US11848660B2Dec 19, 2023
Surface acoustic wave device fabrication method
UNITED MICROELECTRONICS CORP0 citations59
US12387998B2Aug 12, 2025
QFN package and fabricating method of the same
UNITED MICROELECTRONICS CORP0 citations53
US12417985B2Sep 16, 2025
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations52
US7696606B2Apr 13, 2010
Metal structure
UNITED MICROELECTRONICS CORP0 citations51
US7399695B2Jul 15, 2008
Integrated die bumping process
UNITED MICROELECTRONICS CORP1 citations51
US6846697B2Jan 25, 2005
Integrated circuit packages and the method for making the same
UNITED MICROELECTRONICS CORP0 citations51
US12525566B2Jan 13, 2026
Semiconductor package and fabrication method thereof
UNITED MICROELECTRONICS CORP0 citations46
US11495510B2Nov 8, 2022
Semiconductor device package structure and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations45