Inventor
HARTWELL PETER GEORGE
US18 patents
⚠️ This page may combine multiple inventors who share the name “HARTWELL PETER GEORGE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD DEVELOPMENT CO
7 patentsUS7115505B2Oct 3, 2006
Methods for electrically isolating portions of wafers
HEWLETT PACKARD DEVELOPMENT CO45 citations95
US7391090B2Jun 24, 2008
Systems and methods for electrically coupling wires and conductors
HEWLETT PACKARD DEVELOPMENT CO10 citations83
US6750516B2Jun 15, 2004
Systems and methods for electrically isolating portions of wafers
HEWLETT PACKARD DEVELOPMENT CO8 citations73
US7503989B2Mar 17, 2009
Methods and systems for aligning and coupling devices
HEWLETT PACKARD DEVELOPMENT CO5 citations62
US7966880B2Jun 28, 2011
Adjusting the damping level of an encapsulated device
HEWLETT PACKARD DEVELOPMENT CO1 citations52
US7521784B2Apr 21, 2009
System for coupling wire to semiconductor region
HEWLETT PACKARD DEVELOPMENT CO0 citations51
US7429864B2Sep 30, 2008
Systems and methods for rectifying and detecting signals
HEWLETT PACKARD DEVELOPMENT CO0 citations51
INVENSENSE INC
6 patentsUS11802041B2Oct 31, 2023
On-chip signal path with electrical and physical connection
INVENSENSE INC2 citations72
US11299393B2Apr 12, 2022
On-chip signal path with electrical and physical connection
INVENSENSE INC3 citations72
US11092616B2Aug 17, 2021
Method and device for band-pass sensor data acquisition
INVENSENSE INC2 citations72
US10833698B1Nov 10, 2020
Low-power high-precision sensing circuit
INVENSENSE INC5 citations72
US10351419B2Jul 16, 2019
Integrated package containing MEMS acoustic sensor and pressure sensor
INVENSENSE INC3 citations72
US12415720B2Sep 16, 2025
MEMS electrical and physical connection via solder couplings
INVENSENSE INC0 citations51