Inventor

HUANG KUO-CHING

TW110 patents

⚠️ This page may combine multiple inventors who share the name “HUANG KUO-CHING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG KUO-CHING

TAIWAN SEMICONDUCTOR MFG

Double spacer technology for making self-aligned contacts (SAC) on semiconductor integrated circuits

Method for forming a fuse in integrated circuit application

Shallow trench isolation technology to eliminate a kink effect

Method for fabricating a dual-gate dielectric module for memory embedded logic using salicide technology and polycide technology

Resistive switching random access memory structure and method to recreate filament and recover resistance window

Method of defining a buried stack capacitor structure for a one transistor RAM cell

Technology for high performance buried contact and tungsten polycide gate integration

Method to evaluate hemisperical grain (HSG) polysilicon surface

Method to form a recess free deep contact

Capacitor structure for a dynamic random access memory cell

Method for improving the yield on dynamic random access memory (DRAM) with cylindrical capacitor structures

Method and structure improving isolation between memory cell passing gate and capacitor

Method of forming a composite spacer to eliminate polysilicon stringers between elements in a pseudo SRAM cell

Method for making a double-cylinder-capacitor structure for dynamic random access memory (DRAM)

High efficiency thin film inductor

Method for making a fuse structure for improved repaired yields on semiconductor memory devices

Method for fabricating a shallow trench isolation which is not susceptible to buried contact trench formation

Method for fabricating a self aligned contact which eliminates the key hole problem using a two step spacer deposition

Method for making a fuse structure for improved repaired yields on semiconductor memory devices

Hydrogen thermal annealing method for stabilizing microelectronic devices

One-transistor RAM approach for high density memory application

Method and structure for resistive switching random access memory with high reliable and high density

Structure for CMOS image sensor with a plurality of capacitors

High efficiency thin film inductor

High efficiency thin film inductor

Trench-free buried contact

Method for fabricating a self aligned contact which eliminates the key hole problem using a two step contact deposition

Method for forming a polysilicon-interconnect contact in a TFT-SRAM

SRAM memory device with improved performance

Technology for high performance buried contact and tungsten polycide gate integration

Method for manufacturing a TFT SRAM memory device with improved performance

RRAM array using multiple reset voltages and method of resetting RRAM array using multiple reset voltages

TAIWAN SEMICONDUCTOR MFG CO LTD

Embedded transistor

Embedded transistor

Embedded transistor

Metal line connection for improved RRAM reliability, semiconductor arrangement comprising the same, and manufacture thereof

Bottom electrode structure in memory device

Embedded transistor

Memory circuit and formation method thereof

Device and method for forming resistive random access memory cell

Vertical BJT for high density memory

Metal line connection for improved RRAM reliability, semiconductor arrangement comprising the same, and manufacture thereof

Embedded transistor

Innovative approach of 4F2 driver formation for high-density RRAM and MRAM

HIGH TECH COMP CORP

Portable electronic device

TAIWAN SEMICONDCUTOR MFG COMPANY LTD

Structure and method for a forming free resistive random access memory with multi-level cell

TAIWAN SEMICONDUCTOR MANUFATUR

Method to form trench-free buried contact in process with STI technology

HUANG CHE-HUNG

Hand-held deivce

FU CHI-CHANG

Data storage device carrier system

PRIMAX ELECTRONICS LTD

Belt tension adjustment apparatus and an optical scanner using the same