Inventor

AGARWAL PULKIT

US33 patents

⚠️ This page may combine multiple inventors who share the name “AGARWAL PULKIT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

AGARWAL PULKIT

LAM RES CORP

Atomic layer etch methods and hardware for patterning applications

Dielectric gapfill of high aspect ratio features utilizing a sacrificial etch cap layer

Atomic layer clean for removal of photoresist patterning scum

Conical wafer centering and holding device for semiconductor processing

Dielectric gapfill of high aspect ratio features utilizing a sacrificial etch cap layer

Compensating chamber and process effects to improve critical dimension variation for trim process

Methods and apparatuses for increasing reactor processing batch size

Modulated atomic layer deposition

Multi zone substrate support for ALD film property correction and tunability

Automated feedforward and feedback sequence for patterning CD control

Method of improving deposition induced CD imbalance using spatially selective ashing of carbon based film

Method and apparatus for providing station to station uniformity

Controller for controlling core critical dimension variation using flash trim sequence

Method of improving deposition induced CD imbalance using spatially selective ashing of carbon based film

Temperature control of a multi-zone pedestal

Modulated atomic layer deposition

Plasma enhanced atomic layer deposition of silicon-containing films

Dynamic process control in semiconductor manufacturing

Method and apparatus for modulating film uniformity

Method and apparatus for providing station to station uniformity

Method for controlling core critical dimension variation using flash trim sequence

Rapid tuning of critical dimension non-uniformity by modulating temperature transients of multi-zone substrate supports

Use of vacuum during transfer of substrates

Apparatus for cleaning plasma chambers

Azimuthal critical dimension non-uniformity for double patterning process

Trim and deposition profile control with multi-zone heated substrate support for multi-patterning processes

APPLIED MATERIALS INC

Substrate transfer robot end effector

Substrate support apparatus having reduced substrate particle generation

Methods for forming low-resistance contacts through integrated process flow systems

Cleaning of chamber components with solid carbon dioxide particles

IBM

Recommendations for custom software upgrade by cognitive technologies

Methods for representing and storing data in a graph data structure using artificial intelligence

ADOBE SYSTEMS INC

Method and apparatus for performing sentiment analysis based on user reactions to displayable content