Inventor

KUMAR PURUSHOTTAM

US53 patents

⚠️ This page may combine multiple inventors who share the name “KUMAR PURUSHOTTAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KUMAR PURUSHOTTAM

LAM RES CORP

High dry etch rate materials for semiconductor patterning applications

Selective atomic layer deposition for gapfill using sacrificial underlayer

Atomic layer etch methods and hardware for patterning applications

Dielectric gapfill of high aspect ratio features utilizing a sacrificial etch cap layer

Selective atomic layer deposition with post-dose treatment

Atomic layer clean for removal of photoresist patterning scum

Selective atomic layer deposition with post-dose treatment

Conical wafer centering and holding device for semiconductor processing

Ultrathin atomic layer deposition film accuracy thickness control

Multi-cycle ALD process for film uniformity and thickness profile modulation

Methods and apparatuses for showerhead backside parasitic plasma suppression in a secondary purge enabled ALD system

Dynamic precursor dosing for atomic layer deposition

Variable temperature hardware and methods for reduction of wafer backside deposition

Methods and apparatuses for showerhead backside parasitic plasma suppression in a secondary purge enabled ALD system

Dielectric gapfill of high aspect ratio features utilizing a sacrificial etch cap layer

Ultrathin atomic layer deposition film accuracy thickness control

Ultrathin atomic layer deposition film accuracy thickness control

Dynamic precursor dosing for atomic layer deposition

Ultrathin atomic layer deposition film accuracy thickness control

Compensating chamber and process effects to improve critical dimension variation for trim process

Methods and apparatuses for increasing reactor processing batch size

Surface modified depth controlled deposition for plasma based deposition

Systems and methods for flow monitoring in a precursor vapor supply system of a substrate processing system

Method for RF compensation in plasma assisted atomic layer deposition

Atomic layer etch, reactive precursors and energetic sources for patterning applications

Multi-cycle ALD process for film uniformity and thickness profile modulation

Dynamic precursor dosing for atomic layer deposition

Dielectric gapfill using atomic layer deposition (ALD), inhibitor plasma and etching

Dynamic precursor dosing for atomic layer deposition

Method of atomic layer deposition

Method of improving deposition induced CD imbalance using spatially selective ashing of carbon based film

Controller for controlling core critical dimension variation using flash trim sequence

Dielectric gapfill using atomic layer deposition (ALD), inhibitor plasma and etching

Method of improving deposition induced CD imbalance using spatially selective ashing of carbon based film

Surface modified depth controlled deposition for plasma based deposition

Systems and methods for creating airgap seals using atomic layer deposition and high density plasma chemical vapor deposition

Method for providing doped silicon using a diffusion barrier layer

Systems and methods for flow monitoring in a precursor vapor supply system of a substrate processing system

Low-κ ALD gap-fill methods and material

Dynamic process control in semiconductor manufacturing

Variable cycle and time RF activation method for film thickness matching in a multi-station deposition system

Modifying hydrophobicity of a wafer surface using an organosilicon precursor

Method and apparatus for modulating film uniformity

Method for controlling core critical dimension variation using flash trim sequence

Hardware and process for film uniformity improvement

Hardware and process for film uniformity improvement

Apparatus for cleaning plasma chambers

In-situ control of film properties during atomic layer deposition

SINMAT INC

High light extraction efficiency solid state light sources

INTEL CORP

Parking management system and method