Inventor
LIN MING-TSE
TW38 patents
⚠️ This page may combine multiple inventors who share the name “LIN MING-TSE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
31 patentsUS9748167B1Aug 29, 2017
Silicon interposer, semiconductor package using the same, and fabrication method thereof
UNITED MICROELECTRONICS CORP56 citations98
US9478496B1Oct 25, 2016
Wafer to wafer structure and method of fabricating the same
UNITED MICROELECTRONICS CORP48 citations98
US9035457B2May 19, 2015
Substrate with integrated passive devices and method of manufacturing the same
UNITED MICROELECTRONICS CORP21 citations92
US11482485B2Oct 25, 2022
Semiconductor structure
UNITED MICROELECTRONICS CORP7 citations86
US9666507B2May 30, 2017
Through-substrate structure and method for fabricating the same
UNITED MICROELECTRONICS CORP7 citations84
US9123789B2Sep 1, 2015
Chip with through silicon via electrode and method of forming the same
UNITED MICROELECTRONICS CORP12 citations84
US11450633B2Sep 20, 2022
Package structure of semiconductor device with improved bonding between the substrates
UNITED MICROELECTRONICS CORP6 citations74
US12068234B2Aug 20, 2024
Semiconductor structure
UNITED MICROELECTRONICS CORP1 citations73
US11699646B2Jul 11, 2023
Semiconductor structure
UNITED MICROELECTRONICS CORP2 citations73
US10790248B2Sep 29, 2020
Three-dimensional integrated circuit and method of manufacturing the same
UNITED MICROELECTRONICS CORP4 citations73
US10340231B2Jul 2, 2019
Semiconductor package structure and method for forming the same
UNITED MICROELECTRONICS CORP2 citations73
US10325873B2Jun 18, 2019
Chip-stack structure
UNITED MICROELECTRONICS CORP4 citations73
US10153252B2Dec 11, 2018
Wafer to wafer structure and method of fabricating the same
UNITED MICROELECTRONICS CORP4 citations73
US11164822B1Nov 2, 2021
Structure of semiconductor device and method for bonding two substrates
UNITED MICROELECTRONICS CORP3 citations72
US9978666B2May 22, 2018
Method for fabrication semiconductor device with through-substrate via
UNITED MICROELECTRONICS CORP3 citations72
US9123730B2Sep 1, 2015
Semiconductor device having through silicon trench shielding structure surrounding RF circuit
UNITED MICROELECTRONICS CORP5 citations72
US10192808B1Jan 29, 2019
Semiconductor structure
UNITED MICROELECTRONICS CORP2 citations71
US9024416B2May 5, 2015
Semiconductor structure
UNITED MICROELECTRONICS CORP2 citations63
US10886241B1Jan 5, 2021
Semiconductor package structure
UNITED MICROELECTRONICS CORP0 citations62
US12148723B2Nov 19, 2024
Structure of semiconductor device
UNITED MICROELECTRONICS CORP0 citations58
US11557558B2Jan 17, 2023
Structure of semiconductor device and method for bonding two substrates
UNITED MICROELECTRONICS CORP0 citations58
US10818616B2Oct 27, 2020
Semiconductor package structure and method for forming the same
UNITED MICROELECTRONICS CORP0 citations52
US9437491B2Sep 6, 2016
Method of forming chip with through silicon via electrode
UNITED MICROELECTRONICS CORP0 citations52
US9287173B2Mar 15, 2016
Through silicon via and process thereof
UNITED MICROELECTRONICS CORP0 citations52
US9048223B2Jun 2, 2015
Package structure having silicon through vias connected to ground potential
UNITED MICROELECTRONICS CORP0 citations52
US10504821B2Dec 10, 2019
Through-silicon via structure
UNITED MICROELECTRONICS CORP0 citations51
US9761509B2Sep 12, 2017
Semiconductor device with throgh-substrate via and method for fabrication the semiconductor device
UNITED MICROELECTRONICS CORP0 citations51
US11569188B2Jan 31, 2023
Semiconductor device including elongated bonding structure between the substrate
UNITED MICROELECTRONICS CORP0 citations50
US9111850B2Aug 18, 2015
Chuck and semiconductor process using the same
UNITED MICROELECTRONICS CORP0 citations48
US9343359B2May 17, 2016
Integrated structure and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations42
US9412686B2Aug 9, 2016
Interposer structure and manufacturing method thereof
UNITED MICROELECTRONICS CORP0 citations41