Inventor
CAMMARANO ARMANDO S
US10 patents
Patents
10 patentsUS5881945AMar 16, 1999
Multi-layer solder seal band for semiconductor substrates and process
IBM57 citations96
US5881944AMar 16, 1999
Multi-layer solder seal band for semiconductor substrates
IBM53 citations96
US5442239AAug 15, 1995
Structure and method for corrosion and stress-resistant interconnecting metallurgy
IBM33 citations92
US5175609ADec 29, 1992
Structure and method for corrosion and stress-resistant interconnecting metallurgy
IBM38 citations92
US6049456AApr 11, 2000
Electronic module adjustment design and process using shims
IBM12 citations73
US5266522ANov 30, 1993
Structure and method for corrosion and stress-resistant interconnecting metallurgy
IBM18 citations73
US5192622AMar 9, 1993
Low-cost ternary composite for use in vias in glass-ceramic structures
IBM7 citations73
US4465223AAug 14, 1984
Process for brazing
IBM15 citations73
US4360289ANov 23, 1982
Pin for brazing to a substrate and improved package resulting therefrom
IBM1 citations51
US4272722AJun 9, 1981
Determination of electric current flow patterns
IBM0 citations51