Inventor
DIGIACOMO GIULIO
US22 patents
Patents
22 patentsUS6281573B1Aug 28, 2001
Thermal enhancement approach using solder compositions in the liquid state
IBM160 citations98
US6085831AJul 11, 2000
Direct chip-cooling through liquid vaporization heat exchange
IBM115 citations97
US6656770B2Dec 2, 2003
Thermal enhancement approach using solder compositions in the liquid state
IBM74 citations96
US6196443B1Mar 6, 2001
Pb-In-Sn tall C-4 for fatigue enhancement
IBM50 citations96
US6281452B1Aug 28, 2001
Multi-level thin-film electronic packaging structure and related method
IBM53 citations95
US5981310ANov 9, 1999
Multi-chip heat-sink cap assembly
IBM59 citations95
US5420073AMay 30, 1995
Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal
IBM44 citations94
US5367195ANov 22, 1994
Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal
IBM58 citations94
US5539186AJul 23, 1996
Temperature controlled multi-layer module
IBM84 citations93
US6678949B2Jan 20, 2004
Process for forming a multi-level thin-film electronic packaging structure
IBM21 citations92
US6373133B1Apr 16, 2002
Multi-chip module and heat-sink cap combination
IBM34 citations92
US6329721B1Dec 11, 2001
Pb-In-Sn tall C-4 for fatigue enhancement
IBM29 citations92
US6025649AFeb 15, 2000
Pb-In-Sn tall C-4 for fatigue enhancement
IBM19 citations92
US5442239AAug 15, 1995
Structure and method for corrosion and stress-resistant interconnecting metallurgy
IBM33 citations92
US5175609ADec 29, 1992
Structure and method for corrosion and stress-resistant interconnecting metallurgy
IBM38 citations92
US5831336ANov 3, 1998
Ternary solder for the enhancement of C-4 fatigue life
IBM10 citations74
US5266522ANov 30, 1993
Structure and method for corrosion and stress-resistant interconnecting metallurgy
IBM18 citations73
US5192622AMar 9, 1993
Low-cost ternary composite for use in vias in glass-ceramic structures
IBM7 citations73
US4465223AAug 14, 1984
Process for brazing
IBM15 citations73
US5950907ASep 14, 1999
Ternary solder for the enhancement of C-4 fatigue life
IBM3 citations63
US4360289ANov 23, 1982
Pin for brazing to a substrate and improved package resulting therefrom
IBM1 citations51
US4272722AJun 9, 1981
Determination of electric current flow patterns
IBM0 citations51