Inventor
OSAWA MITSUNADA
JP10 patents
⚠️ This page may combine multiple inventors who share the name “OSAWA MITSUNADA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
9 patentsUS6881611B1Apr 19, 2005
Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device
FUJITSU LTD85 citations98
US5679978AOct 21, 1997
Semiconductor device having resin gate hole through substrate for resin encapsulation
FUJITSU LTD96 citations95
US6379997B1Apr 30, 2002
Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same
FUJITSU LTD54 citations94
US6111306AAug 29, 2000
Semiconductor device and method of producing the same and semiconductor device unit and method of producing the same
FUJITSU LTD83 citations94
US6696754B2Feb 24, 2004
Semiconductor module including a plurality of semiconductor devices detachably
FUJITSU LTD20 citations92
US6472744B2Oct 29, 2002
Semiconductor module including a plurality of semiconductor devices detachably
FUJITSU LTD31 citations92
US5844309ADec 1, 1998
Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition
FUJITSU LTD46 citations92
US5226582AJul 13, 1993
Method for wire-bonding an integrated circuit
FUJITSU LTD23 citations92
US6034428AMar 7, 2000
Semiconductor integrated circuit device having stacked wiring and insulating layers
FUJITSU LTD9 citations72