Inventor

BRODSKY WILLIAM LOUIS

US44 patents

⚠️ This page may combine multiple inventors who share the name “BRODSKY WILLIAM LOUIS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BRODSKY WILLIAM LOUIS

IBM

Printed circuit board to module mounting and interconnecting structure and method

Flexible circuitized interposer with apertured member and method for making same

Flexible circuitized interposer with apertured member and method for making same

Releasable, repeatable electrical connections employing compression

Electronic package with heat transfer means

High performance electrical cable

Plastic land grid array (PLGA) module with inverted hybrid land grid array (LGA) interposer

Printed wiring board interposer sub-assembly and method

Enhanced electrical/mechanical connection for electronic devices

Method of controlling shock and vibration of electrical interconnects

Printed wiring board interposer sub-assembly

Method and structure for controlled shock and vibration of electrical interconnects

Method and apparatus for electroplating

Article extraction / insertion tool and assembly

Releasable, repeatable electrical connection employing compression

Releasable, repeatable electrical connection employing compression

Releasable, repeatable electrical connection employing compression

Surface mount socket

Elastomeric structure with multi-layered elastomer and constraining base

Computer system with surface mount socket

Heat sink structure with corrugated wound wire heat conductive elements

Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member

Method and structure for implementing enhanced interconnection performance of a land grid array (LGA) module and a printed wiring board

Electronic package structures using land grid array interposers for module-to-board interconnection

Circuitized structure including flexible circuit with elastomeric member bonded thereto

Method of making an interposer sub-assembly in a printed wiring board

Electrical connector assembly for connecting first and second circuitized substrates

Pin grid array zero insertion force connectors configurable for supporting large pin counts

Pin grid array zero insertion force connectors configurable for supporting large pin counts

Providing mechanical support for modular interconnect systems

Anode container, electroplating system, method and plated object

Conductive particle filled polymer electrical contact

Wadded-wire LGA contact with parallel solid conductor

Structure for controlled shock and vibration of electrical interconnects

Structure for controlled shock and vibration of electrical interconnects

Interposer member having apertures for relieving stress and increasing contact compliancy

High performance electrical cable and method of manufacture

Electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member

Method of compensating for thermal expansion in SMT interconnects

Circuitized structure including flexible circuit with elastomeric member bonded thereto and method of making

Electrical cable assembly

BRODSKY WILLIAM LOUIS

Apparatus for electrically connecting two substrates using a land grid array connector provided with a frame structure having power distribution elements

Plastic land grid array (PLGA) module and printed wiring board (PWB) with enhanced contact metallurgy construction

QUANTUM CORP

Releasable, repeatable electrical connection employing compression