Inventor
MATSUYAMA HARUHIKO
JP17 patents
Patents
17 patentsUS5868949AFeb 9, 1999
Metalization structure and manufacturing method thereof
HITACHI LTD93 citations95
US5388328AFeb 14, 1995
Process for fabricating an interconnected multilayer board
HITACHI LTD69 citations95
US5300735AApr 5, 1994
Interconnected multilayer boards and fabrication processes thereof
HITACHI LTD42 citations95
US4748228AMay 31, 1988
Process for producing organic silicon-terminated polyimide precursor and polyimide
HITACHI LTD55 citations94
US5208656AMay 4, 1993
Multilayer wiring substrate and production thereof
HITACHI LTD23 citations92
US4486232ADec 4, 1984
Electrode material for semi-conductor devices
HITACHI LTD47 citations92
US4643913AFeb 17, 1987
Process for producing solar cells
HITACHI LTD48 citations91
US6124553ASep 26, 2000
Multilayer wiring board having vent holes and method of making
HITACHI LTD17 citations84
US5958600ASep 28, 1999
Circuit board and method of manufacturing the same
HITACHI LTD11 citations73
US4824731AApr 25, 1989
Thin film magnetic head
HITACHI LTD8 citations73
US5851681ADec 22, 1998
Wiring structure with metal wiring layers and polyimide layers, and fabrication process of multilayer wiring board
HITACHI LTD8 citations70
US4686147AAug 11, 1987
Magnetic head and method of producing the same
HITACHI LTD18 citations69
US5970310AOct 19, 1999
Method for manufacturing multilayer wiring board and wiring pattern forming apparatus
HITACHI LTD8 citations65
US5753372AMay 19, 1998
Wiring structures and method of manufacturing the same
HITACHI LTD3 citations59
US6132852AOct 17, 2000
Multilayer wiring substrate and method for production thereof
HITACHI LTD0 citations52
US4772505ASep 20, 1988
Magnetic bubble memory element
HITACHI LTD1 citations52
US5280102AJan 18, 1994
Heat-resistant bonding materials
HITACHI LTD1 citations51