Inventor

AKAHOSHI HARUO

JP71 patents

⚠️ This page may combine multiple inventors who share the name “AKAHOSHI HARUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

AKAHOSHI HARUO

HITACHI LTD

Semiconductor device having cobalt alloy film with boron

Semiconductor module and method of mounting

Semiconductor device having a stress relieving mechanism

Method for formation of conductor using electroless plating

LSI package board

Circuit board and process for producing the same

Composite article comprising a copper element and a process for producing it

Lithium secondary battery, its electrolyte, and electric apparatus using the same

Semiconductor device and method of manufacturing the same

Method of bonding copper and resin

High dielectric constant composite material and multilayer wiring board using the same

Semiconductor module and mounting method for same

Method for manufacture of printed wiring board

Electroless copper plating solution, electroless copper plating process and production process of circuit board

Method of making a semiconductor device having a stress relieving mechanism

Semiconductor device and method for manufacturing the same technical field

Process for producing printed circuit board

Method for producing thin film multilayer wiring board

Printed circuit board and method and apparatus for making same

Copper-based oxidation catalyst and its applications

Process for the formation of a conductive circuit pattern

Catalyst material and method of manufacturing the same and fuel cell using the same

Wiring board and production method thereof, and semiconductor apparatus

Plating method using an additive

Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus

Process for electroless copper plating

Process for electroless copper plating and apparatus used therefor

High dielectric constant composite material and multilayer wiring board using the same

Method for manufacturing printed circuit board

Wiring substrate and an electroless copper plating solution for providing interlayer connections

Printed circuit board, process for preparing the same and resist ink used therefor

Copper-based oxidation catalyst and its application

Method for forming wiring pattern

Process for producing printed circuit board

Process for producing printed wiring board

Adhesive agent for substrate of electroless plating, printed circuit board using same, and method of producing same

Member having metallic layer, its manufacturing method and its application

HITACHI DISPLAYS LTD

Lighting source unit, illuminating apparatus using the same and display apparatus using the same

Illuminating apparatus, method for fabricating the using the same and display apparatus using the same

Lighting system and display apparatus using the same

RENESAS TECH CORP

Semiconductor module and mounting method for same

Semiconductor device comprising stress relaxation layers and method for manufacturing the same

Process and apparatus for manufacturing a semiconductor device

HITACHI CHEMICAL CO LTD

Suspended particle device, light control device using the same, and driving method

Process for preparing printed circuit board

YOSHIDA HIROSHI

Fine metal structure, process for producing the same, fine metal mold and device

OGINO MASAHIKO

Fine pattern mold

HITACHI VIA MECHANICS LTD

Manufacturing method of printed wiring board as well as copper-clad laminate and treatment solutions used therefor

ISHIBASHI RYO

High corrosion resistant equipment for a plant

Hitachi Via Mechanics

Method for manufacturing printed wiring board and electrolytic etching solution for use in the manufacturing method