Inventor
CHO SEON-MEE
US34 patents
⚠️ This page may combine multiple inventors who share the name “CHO SEON-MEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
16 patentsUS7036453B2May 2, 2006
Apparatus for reducing plasma charge damage for plasma processes
APPLIED MATERIALS INC467 citations98
US6660662B2Dec 9, 2003
Method of reducing plasma charge damage for plasma processes
APPLIED MATERIALS INC478 citations98
US6486082B1Nov 26, 2002
CVD plasma assisted lower dielectric constant sicoh film
APPLIED MATERIALS INC80 citations98
US6399489B1Jun 4, 2002
Barrier layer deposition using HDP-CVD
APPLIED MATERIALS INC110 citations97
US6713390B2Mar 30, 2004
Barrier layer deposition using HDP-CVD
APPLIED MATERIALS INC62 citations95
US6926926B2Aug 9, 2005
Silicon carbide deposited by high density plasma chemical-vapor deposition with bias
APPLIED MATERIALS INC21 citations93
US7531469B2May 12, 2009
Dosimetry using optical emission spectroscopy/residual gas analyzer in conjunction with ion current
APPLIED MATERIALS INC8 citations84
US7968439B2Jun 28, 2011
Plasma immersion ion implantation method using a pure or nearly pure silicon seasoning layer on the chamber interior surfaces
APPLIED MATERIALS INC6 citations74
US6943127B2Sep 13, 2005
CVD plasma assisted lower dielectric constant SICOH film
APPLIED MATERIALS INC6 citations74
US9818580B2Nov 14, 2017
Transmission line RF applicator for plasma chamber
APPLIED MATERIALS INC2 citations71
US7871828B2Jan 18, 2011
In-situ dose monitoring using optical emission spectroscopy
APPLIED MATERIALS INC4 citations63
US7691755B2Apr 6, 2010
Plasma immersion ion implantation with highly uniform chamber seasoning process for a toroidal source reactor
APPLIED MATERIALS INC4 citations63
US7153787B2Dec 26, 2006
CVD plasma assisted lower dielectric constant SICOH film
APPLIED MATERIALS INC3 citations63
US9935183B2Apr 3, 2018
Multilayer passivation or etch stop TFT
APPLIED MATERIALS INC0 citations52
US9590113B2Mar 7, 2017
Multilayer passivation or etch stop TFT
APPLIED MATERIALS INC0 citations52
US9245809B2Jan 26, 2016
Pin hole evaluation method of dielectric films for metal oxide semiconductor TFT
APPLIED MATERIALS INC0 citations52
NOVELLUS SYSTEMS INC
9 patentsUS7622162B1Nov 24, 2009
UV treatment of STI films for increasing tensile stress
NOVELLUS SYSTEMS INC63 citations98
US7265061B1Sep 4, 2007
Method and apparatus for UV exposure of low dielectric constant materials for porogen removal and improved mechanical properties
NOVELLUS SYSTEMS INC632 citations98
US7589028B1Sep 15, 2009
Hydroxyl bond removal and film densification method for oxide films using microwave post treatment
NOVELLUS SYSTEMS INC424 citations97
US7253125B1Aug 7, 2007
Method to improve mechanical strength of low-k dielectric film using modulated UV exposure
NOVELLUS SYSTEMS INC82 citations97
US7611757B1Nov 3, 2009
Method to improve mechanical strength of low-K dielectric film using modulated UV exposure
NOVELLUS SYSTEMS INC39 citations95
US7163899B1Jan 16, 2007
Localized energy pulse rapid thermal anneal dielectric film densification method
NOVELLUS SYSTEMS INC38 citations93
US8043667B1Oct 25, 2011
Method to improve mechanical strength of low-K dielectric film using modulated UV exposure
NOVELLUS SYSTEMS INC18 citations92
US7892985B1Feb 22, 2011
Method for porogen removal and mechanical strength enhancement of low-k carbon doped silicon oxide using low thermal budget microwave curing
NOVELLUS SYSTEMS INC18 citations84
US7491653B1Feb 17, 2009
Metal-free catalysts for pulsed deposition layer process for conformal silica laminates
NOVELLUS SYSTEMS INC7 citations74