Inventor
LEE PETER WAI-MAN
US18 patents
Patents
18 patentsUS6486082B1Nov 26, 2002
CVD plasma assisted lower dielectric constant sicoh film
APPLIED MATERIALS INC80 citations98
US5792269AAug 11, 1998
Gas distribution for CVD systems
APPLIED MATERIALS INC164 citations98
US6709715B1Mar 23, 2004
Plasma enhanced chemical vapor deposition of copolymer of parylene N and comonomers with various double bonds
APPLIED MATERIALS INC109 citations97
US6086952AJul 11, 2000
Chemical vapor deposition of a copolymer of p-xylylene and a multivinyl silicon/oxygen comonomer
APPLIED MATERIALS INC93 citations97
US6107184AAug 22, 2000
Nano-porous copolymer films having low dielectric constants
APPLIED MATERIALS INC52 citations96
US6149987ANov 21, 2000
Method for depositing low dielectric constant oxide films
APPLIED MATERIALS INC61 citations95
US7030041B2Apr 18, 2006
Adhesion improvement for low k dielectrics
APPLIED MATERIALS INC45 citations94
US7024105B2Apr 4, 2006
Substrate heater assembly
APPLIED MATERIALS INC56 citations94
US7745328B2Jun 29, 2010
Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)
APPLIED MATERIALS INC12 citations92
US6838393B2Jan 4, 2005
Method for producing semiconductor including forming a layer containing at least silicon carbide and forming a second layer containing at least silicon oxygen carbide
APPLIED MATERIALS INC24 citations92
US6663713B1Dec 16, 2003
Method and apparatus for forming a thin polymer layer on an integrated circuit structure
APPLIED MATERIALS INC51 citations90
US6943127B2Sep 13, 2005
CVD plasma assisted lower dielectric constant SICOH film
APPLIED MATERIALS INC6 citations74
US7465659B2Dec 16, 2008
Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)
APPLIED MATERIALS INC8 citations73
US7157384B2Jan 2, 2007
Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)
APPLIED MATERIALS INC7 citations73
US7153787B2Dec 26, 2006
CVD plasma assisted lower dielectric constant SICOH film
APPLIED MATERIALS INC3 citations63
US6911403B2Jun 28, 2005
Methods of reducing plasma-induced damage for advanced plasma CVD dielectrics
APPLIED MATERIALS INC5 citations63
US6523494B1Feb 25, 2003
Apparatus for depositing low dielectric constant oxide film
APPLIED MATERIALS INC5 citations62
US7459404B2Dec 2, 2008
Adhesion improvement for low k dielectrics
APPLIED MATERIALS INC2 citations60