Inventor

ZHANG BEI CHAO

SG24 patents

⚠️ This page may combine multiple inventors who share the name “ZHANG BEI CHAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ZHANG BEI CHAO

CHARTERED SEMICONDUCTOR MFG

Entire encapsulation of Cu interconnects using self-aligned CuSiN film

Self-patterning of photo-active dielectric materials for interconnect isolation

Reliable interconnects

Thermal stability improvement of CoSi2 film by stuffing in titanium

Using refractory metal silicidation phase transition temperature points to control and/or calibrate RTP low temperature operation

Integrated circuit with simultaneous fabrication of dual damascene via and trench

Method to fabricate aligned dual damascene openings

Via electromigration improvement by changing the via bottom geometric profile

Method of fabrication of a die oxide ring

Semiconductor processing system with ultra low-K dielectric

Method to form alpha phase Ta and its application to IC manufacturing

Structure and method to prevent charge damage from e-beam curing process

Method for corrosion prevention during planarization

Via electromigration improvement by changing the via bottom geometric profile

Method to fabricate aligned dual damascene openings

Self-patterning of photo-active dielectric materials for interconnect isolation

GLOBALFOUNDRIES SG PTE LTD

Integrated circuit system employing low-k dielectrics and method of manufacture thereof

Poly profile engineering to modulate spacer induced stress for device enhancement

SEAH BOON MENG

Apparatus and methods for cleaning and drying of wafers

ZHANG SHAOQING

Integrated circuit system employing back end of line via techniques

ZHANG BEI CHAO

Reliable interconnects

DU LUYING

Reliable interconnect integration scheme

SHENG HAIFENG

Integrated circuit system employing alternating conductive layers

HO VINCENT

Poly profile engineering to modulate spacer induced stress for device enhancement