Inventor

CHIANG CHAU FATT

MY30 patents

⚠️ This page may combine multiple inventors who share the name “CHIANG CHAU FATT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHIANG CHAU FATT

INFINEON TECHNOLOGIES AG

Chip to lead interconnect in encapsulant of molded semiconductor package

Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device

Chip to chip interconnect in encapsulant of molded semiconductor package

Semiconductor package with a through port for sensor applications

Semiconductor package with plateable encapsulant and a method for manufacturing the same

Semiconductor package with air cavity

Chip to chip interconnect in encapsulant of molded semiconductor package

Over-under sensor packaging with sensor spaced apart from control chip

Micro-electrical mechanical system sensor package and method of manufacture thereof

Double-sided cooled molded semiconductor package

Manufacturing a package using plateable encapsulant

Molded semiconductor package with double-sided cooling

Multi-phase half bridge driver package and methods of manufacture

Pressure sensor having a lidless/laminate structure

Method of manufacturing a semiconductor package using a carrier

Semiconductor package and method for fabricating a semiconductor package

Method of producing multiple semiconductor devices

Dual step laser processing of an encapsulant of a semiconductor chip package

Device having substrate with conductive pillars

Device having substrate with conductive pillars

Method of manufacturing a semiconductor package with a bump using a carrier

Semiconductor packages and methods for manufacturing thereof

Over-under sensor packaging with sensor spaced apart from control chip

Semiconductor package with metal posts from structured leadframe

Semiconductor package with lead tip inspection feature

Molding system with movable mold tool

Semiconductor package and method for fabricating a semiconductor package

Molded cavity package with embedded conductive layer and enhanced sealing

Method and apparatus for simultaneously encapsulating semiconductor dies with layered lead frame strips

INFINEON TECHNOLOGIES AUSTRIA AG

Leadframe, semiconductor package and method