Inventor
CHA CHAN LAM
MY8 patents
⚠️ This page may combine multiple inventors who share the name “CHA CHAN LAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
7 patentsUS11469161B2Oct 11, 2022
Lead frame-based semiconductor package
INFINEON TECHNOLOGIES AG1 citations61
US10396018B2Aug 27, 2019
Multi-phase half bridge driver package and methods of manufacture
INFINEON TECHNOLOGIES AG1 citations59
US11274984B2Mar 15, 2022
Pressure sensor having a lidless/laminate structure
INFINEON TECHNOLOGIES AG0 citations58
US12300559B2May 13, 2025
Semiconductor packages and methods for manufacturing thereof
INFINEON TECHNOLOGIES AG0 citations50
US12278171B2Apr 15, 2025
Chip package and method of forming a chip package
INFINEON TECHNOLOGIES AG0 citations50
US11217511B2Jan 4, 2022
Quad package with conductive clips connected to terminals at upper surface of semiconductor die
INFINEON TECHNOLOGIES AG1 citations50
US12176222B2Dec 24, 2024
Semiconductor package with metal posts from structured leadframe
INFINEON TECHNOLOGIES AG0 citations48