Inventor
LEE SWEE KAH
MY29 patents
⚠️ This page may combine multiple inventors who share the name “LEE SWEE KAH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
24 patentsUS9475691B1Oct 25, 2016
Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device
INFINEON TECHNOLOGIES AG14 citations80
US9219025B1Dec 22, 2015
Molded flip-clip semiconductor package
INFINEON TECHNOLOGIES AG12 citations80
US10396007B2Aug 27, 2019
Semiconductor package with plateable encapsulant and a method for manufacturing the same
INFINEON TECHNOLOGIES AG4 citations71
US10431560B2Oct 1, 2019
Molded semiconductor package having an optical inspection feature
INFINEON TECHNOLOGIES AG2 citations67
US9806043B2Oct 31, 2017
Method of manufacturing molded semiconductor packages having an optical inspection feature
INFINEON TECHNOLOGIES AG2 citations67
US9852918B2Dec 26, 2017
Embedding additive particles in encapsulant of electronic device
INFINEON TECHNOLOGIES AG2 citations66
US11469161B2Oct 11, 2022
Lead frame-based semiconductor package
INFINEON TECHNOLOGIES AG1 citations61
US11174152B2Nov 16, 2021
Over-under sensor packaging with sensor spaced apart from control chip
INFINEON TECHNOLOGIES AG0 citations61
US11302613B2Apr 12, 2022
Double-sided cooled molded semiconductor package
INFINEON TECHNOLOGIES AG0 citations60
US11081417B2Aug 3, 2021
Manufacturing a package using plateable encapsulant
INFINEON TECHNOLOGIES AG1 citations60
US10886199B1Jan 5, 2021
Molded semiconductor package with double-sided cooling
INFINEON TECHNOLOGIES AG1 citations60
US11682644B2Jun 20, 2023
Semiconductor device with a heterogeneous solder joint and method for fabricating the same
INFINEON TECHNOLOGIES AG0 citations58
US11274984B2Mar 15, 2022
Pressure sensor having a lidless/laminate structure
INFINEON TECHNOLOGIES AG0 citations58
US11791169B2Oct 17, 2023
Dual step laser processing of an encapsulant of a semiconductor chip package
INFINEON TECHNOLOGIES AG0 citations52
US10304780B2May 28, 2019
Device having substrate with conductive pillars
INFINEON TECHNOLOGIES AG0 citations51
US10163812B2Dec 25, 2018
Device having substrate with conductive pillars
INFINEON TECHNOLOGIES AG0 citations51
US9287238B2Mar 15, 2016
Leadless semiconductor package with optical inspection feature
INFINEON TECHNOLOGIES AG1 citations51
US10501312B2Dec 10, 2019
Over-under sensor packaging with sensor spaced apart from control chip
INFINEON TECHNOLOGIES AG0 citations50
US12176222B2Dec 24, 2024
Semiconductor package with metal posts from structured leadframe
INFINEON TECHNOLOGIES AG0 citations48
US12550751B2Feb 10, 2026
Flip chip bonding for semiconductor packages using metal strip
INFINEON TECHNOLOGIES AG0 citations41
US10914018B2Feb 9, 2021
Porous Cu on Cu surface for semiconductor packages
INFINEON TECHNOLOGIES AG0 citations41
US9868632B2Jan 16, 2018
Molded cavity package with embedded conductive layer and enhanced sealing
INFINEON TECHNOLOGIES AG0 citations41
US10099411B2Oct 16, 2018
Method and apparatus for simultaneously encapsulating semiconductor dies with layered lead frame strips
INFINEON TECHNOLOGIES AG0 citations35
US9540539B2Jan 10, 2017
Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor device
INFINEON TECHNOLOGIES AG0 citations34
INFINEON TECHNOLOGIES AUSTRIA AG
3 patentsUS12218038B2Feb 4, 2025
Leadframe, semiconductor package and method
INFINEON TECHNOLOGIES AUSTRIA AG0 citations60
US12232302B2Feb 18, 2025
Dipped coated electronic module assembly with enhanced thermal distribution
INFINEON TECHNOLOGIES AUSTRIA AG0 citations51
US11289436B2Mar 29, 2022
Semiconductor package having a laser-activatable mold compound
INFINEON TECHNOLOGIES AUSTRIA AG0 citations50