Inventor
PRABHU ASHOK
US21 patents
⚠️ This page may combine multiple inventors who share the name “PRABHU ASHOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NAT SEMICONDUCTOR CORP
12 patentsUS6607941B2Aug 19, 2003
Process and structure improvements to shellcase style packaging technology
NAT SEMICONDUCTOR CORP141 citations98
US6384397B1May 7, 2002
Low cost die sized module for imaging application having a lens housing assembly
NAT SEMICONDUCTOR CORP215 citations98
US6238949B1May 29, 2001
Method and apparatus for forming a plastic chip on chip package module
NAT SEMICONDUCTOR CORP156 citations98
US6791072B1Sep 14, 2004
Method and apparatus for forming curved image sensor module
NAT SEMICONDUCTOR CORP104 citations97
US7067354B2Jun 27, 2006
Electrical die contact structure and fabrication method
NAT SEMICONDUCTOR CORP40 citations96
US6781244B2Aug 24, 2004
Electrical die contact structure and fabrication method
NAT SEMICONDUCTOR CORP55 citations96
US6352881B1Mar 5, 2002
Method and apparatus for forming an underfill adhesive layer
NAT SEMICONDUCTOR CORP70 citations94
US7615407B1Nov 10, 2009
Methods and systems for packaging integrated circuits with integrated passive components
NAT SEMICONDUCTOR CORP17 citations84
US7205095B1Apr 17, 2007
Apparatus and method for packaging image sensing semiconductor chips
NAT SEMICONDUCTOR CORP10 citations84
US7795126B2Sep 14, 2010
Electrical die contact structure and fabrication method
NAT SEMICONDUCTOR CORP12 citations83
US7491625B2Feb 17, 2009
Gang flipping for IC packaging
NAT SEMICONDUCTOR CORP9 citations82
US7340181B1Mar 4, 2008
Electrical die contact structure and fabrication method
NAT SEMICONDUCTOR CORP7 citations73
TEXAS INSTRUMENTS INC
7 patentsUS11021786B2Jun 1, 2021
Copper passivation
TEXAS INSTRUMENTS INC2 citations72
US10763231B2Sep 1, 2020
Bump bond structure for enhanced electromigration performance
TEXAS INSTRUMENTS INC2 citations71
US11367699B2Jun 21, 2022
Integrated circuit backside metallization
TEXAS INSTRUMENTS INC0 citations62
US10763230B2Sep 1, 2020
Integrated circuit backside metallization
TEXAS INSTRUMENTS INC1 citations62
US11450638B2Sep 20, 2022
Bump bond structure for enhanced electromigration performance
TEXAS INSTRUMENTS INC0 citations60
US10650957B1May 12, 2020
Additive deposition low temperature curable magnetic interconnecting layer for power components integration
TEXAS INSTRUMENTS INC0 citations52
US11410875B2Aug 9, 2022
Fan-out electronic device
TEXAS INSTRUMENTS INC0 citations51