Inventor

TSUKADA KIYOTAKA

JP49 patents

⚠️ This page may combine multiple inventors who share the name “TSUKADA KIYOTAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSUKADA KIYOTAKA

IBIDEN CO LTD

Printed wiring board and method for manufacturing the same

Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic plating

Printed wiring board having throughole and annular lands

Printed-circuit board and method of manufacture thereof

Printed wiring board and method for producing the same

Printed wiring board and method of manufacturing the same

Electronic circuit substrate

Porous silicon carbide sinter and its production

Method of manufacturing multilayered circuit board

Electronic component mounting base board having heat slug with slits and projections

Soldering member for printed wiring boards

Unique ceramic compound

Powder composition for producing sintered ceramic

Printed wiring board and method for manufacturing the same

Method of manufacturing a printed wiring board having a previously formed opening hole in an innerlayer conductor circuit

Printed wiring board and method for manufacturing the same

Printed wiring board and method of manufacturing the same

Electronic component mounting base board and method of producing the same

Method of manufacturing a multilayered printed circuit board

Printed wiring board having a solder pad and a method for manufacturing the same

Printed wiring board and method for manufacturing printed wiring board

Flexible printed wiring board

Flexible printed wiring board

Heat-resistant composite body

Process for producing a power composition for producing sintered ceramic articles

Method of producing a silicon carbide sintered compact

Printed wiring board and method of manufacturing the same

Multilayer printed wiring board and method for manufacturing the same

Substrate for mounting electronic part having conductive projections and process for manufacturing the same

Antiviral substrate, antiviral composition, method for manufacturing antiviral substrate, antimicrobial substrate, antimicrobial composition and method for manufacturing antimicrobial substrate

Substrate for mounting electronic component and method for manufacturing the same

Process for preparing heat-resistant composite body

Method of manufacturing printed wiring board

Method of manufacturing printed wiring board

Semiconductor device and method for manufacturing the same

Antiviral substrate, antiviral composition, method for manufacturing antiviral substrate, antimicrobial substrate, antimicrobial composition and method for manufacturing antimicrobial substrate

Antiviral substrate, antiviral composition, method for manufacturing antiviral substrate, antimicrobial substrate, antimicrobial composition and method for manufacturing antimicrobial substrate

Printed wiring board

Thin-film embedded capacitance, method for manufacturing thereof, and a printed wiring board

Light-emitting element mounting substrate and method for manufacturing light-emitting element mounting substrate

TSUKADA KIYOTAKA

Circuit board and semiconductor module

Semiconductor device and fabrication method therefor

Printed wiring board with reinforced insulation layer and manufacturing method thereof

Printed wiring board with resin complex layer and manufacturing method thereof

Semiconductor device and production method thereof

HIROSE NAOHIRO

Multilayered printed circuit board and manufacturing method thereof

AGENCY IND SCIENCE TECHN

Thermal storage unit

KITAMURA VALVE KK

Valve provided with valve bodies made of a ceramic compound

IWAI TSUTOMU

Method for manufacturing printed wiring board