Inventor
TU HSIU WEN
TW35 patents
⚠️ This page may combine multiple inventors who share the name “TU HSIU WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KINGPAK TECH INC
23 patentsUS7423334B2Sep 9, 2008
Image sensor module with a protection layer and a method for manufacturing the same
KINGPAK TECH INC20 citations92
US6521881B2Feb 18, 2003
Stacked structure of an image sensor and method for manufacturing the same
KINGPAK TECH INC53 citations92
US6696738B1Feb 24, 2004
Miniaturized image sensor
KINGPAK TECH INC44 citations91
US6646316B2Nov 11, 2003
Package structure of an image sensor and packaging
KINGPAK TECH INC35 citations91
US6870208B1Mar 22, 2005
Image sensor module
KINGPAK TECH INC25 citations90
US6590269B1Jul 8, 2003
Package structure for a photosensitive chip
KINGPAK TECH INC46 citations89
US7554599B2Jun 30, 2009
Image sensor module with air escape hole and a method for manufacturing the same
KINGPAK TECH INC17 citations83
US8969120B2Mar 3, 2015
Two-stage packaging method of image sensors
KINGPAK TECH INC15 citations81
US6874227B2Apr 5, 2005
Method for packaging an image sensor
KINGPAK TECH INC17 citations81
US10964615B2Mar 30, 2021
Chip-scale sensor package structure
KINGPAK TECH INC2 citations73
US10692917B2Jun 23, 2020
Sensor package structure
KINGPAK TECH INC5 citations72
US10720370B2Jul 21, 2020
Sensor package structure
KINGPAK TECH INC2 citations71
US10340250B2Jul 2, 2019
Stack type sensor package structure
KINGPAK TECH INC6 citations71
US10170508B2Jan 1, 2019
Optical package structure
KINGPAK TECH INC4 citations67
US10700111B2Jun 30, 2020
Optical sensor
KINGPAK TECH INC1 citations62
US10236313B2Mar 19, 2019
Sensor package structure
KINGPAK TECH INC1 citations62
US10186538B2Jan 22, 2019
Sensor package structure
KINGPAK TECH INC1 citations62
US10825851B2Nov 3, 2020
Sensor package structure
KINGPAK TECH INC1 citations61
US6565008B2May 20, 2003
Module card and a method for manufacturing the same
KINGPAK TECH INC3 citations59
US9184331B2Nov 10, 2015
Method for reducing tilt of optical unit during manufacture of image sensor
KINGPAK TECH INC1 citations50
US8378441B2Feb 19, 2013
Manufacturing method and structure of a wafer level image sensor module with package structure
KINGPAK TECH INC0 citations50
US10600830B2Mar 24, 2020
Sensor package structure
KINGPAK TECH INC0 citations40
US8703519B1Apr 22, 2014
Structure and manufacturing method for high resolution camera module
KINGPAK TECH INC0 citations39
TU HSIU-WEN
8 patentsUS8563350B2Oct 22, 2013
Wafer level image sensor packaging structure and manufacturing method for the same
TU HSIU-WEN7 citations82
US8440488B2May 14, 2013
Manufacturing method and structure for wafer level image sensor module with fixed focal length
TU HSIU-WEN8 citations82
US8390087B2Mar 5, 2013
Image sensor package structure with large air cavity
TU HSIU-WEN7 citations80
US8928104B2Jan 6, 2015
Image sensor packaging structure with black encapsulant
TU HSIU-WEN4 citations71
US8847146B2Sep 30, 2014
Image sensor package structure with casing including a vent without sealing and in communication with package material
TU HSIU-WEN4 citations71
US8441086B2May 14, 2013
Image sensor packaging structure with predetermined focal length
TU HSIU-WEN6 citations71
US8093674B2Jan 10, 2012
Manufacturing method for molding image sensor package structure and image sensor package structure thereof
TU HSIU-WEN5 citations61
US8828777B2Sep 9, 2014
Wafer level image sensor packaging structure and manufacturing method of the same
TU HSIU-WEN0 citations50