Inventor
HSIN CHUNG HSIEN
TW38 patents
⚠️ This page may combine multiple inventors who share the name “HSIN CHUNG HSIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KINGPAK TECH INC
26 patentsUS7423334B2Sep 9, 2008
Image sensor module with a protection layer and a method for manufacturing the same
KINGPAK TECH INC20 citations92
US6933493B2Aug 23, 2005
Image sensor having a photosensitive chip mounted to a metal sheet
KINGPAK TECH INC18 citations84
US6876544B2Apr 5, 2005
Image sensor module and method for manufacturing the same
KINGPAK TECH INC17 citations84
US6740973B1May 25, 2004
Stacked structure for an image sensor
KINGPAK TECH INC16 citations84
US9905597B2Feb 27, 2018
Sensor package structure
KINGPAK TECH INC7 citations83
US7554599B2Jun 30, 2009
Image sensor module with air escape hole and a method for manufacturing the same
KINGPAK TECH INC17 citations83
US7196322B1Mar 27, 2007
Image sensor package
KINGPAK TECH INC10 citations83
US7598580B1Oct 6, 2009
Image sensor module package structure with supporting element
KINGPAK TECH INC14 citations82
US6874227B2Apr 5, 2005
Method for packaging an image sensor
KINGPAK TECH INC17 citations81
US11309275B2Apr 19, 2022
Sensor package structure
KINGPAK TECH INC3 citations73
US10692917B2Jun 23, 2020
Sensor package structure
KINGPAK TECH INC5 citations72
US10720370B2Jul 21, 2020
Sensor package structure
KINGPAK TECH INC2 citations71
US10411055B2Sep 10, 2019
Sensor package structure
KINGPAK TECH INC2 citations71
US10170508B2Jan 1, 2019
Optical package structure
KINGPAK TECH INC4 citations67
US7368795B2May 6, 2008
Image sensor module with passive component
KINGPAK TECH INC3 citations63
US6791842B2Sep 14, 2004
Image sensor structure
KINGPAK TECH INC4 citations63
US10236313B2Mar 19, 2019
Sensor package structure
KINGPAK TECH INC1 citations62
US10186538B2Jan 22, 2019
Sensor package structure
KINGPAK TECH INC1 citations62
US7440263B2Oct 21, 2008
Image sensor and method for manufacturing the same
KINGPAK TECH INC0 citations52
US7402839B2Jul 22, 2008
Image sensor package structure
KINGPAK TECH INC0 citations52
US9184331B2Nov 10, 2015
Method for reducing tilt of optical unit during manufacture of image sensor
KINGPAK TECH INC1 citations50
US8378441B2Feb 19, 2013
Manufacturing method and structure of a wafer level image sensor module with package structure
KINGPAK TECH INC0 citations50
US8004602B2Aug 23, 2011
Image sensor structure and integrated lens module thereof
KINGPAK TECH INC1 citations50
US7064404B1Jun 20, 2006
Image sensor structure
KINGPAK TECH INC1 citations47
US7268346B2Sep 11, 2007
Method of disassembling an image sensor package
KINGPAK TECH INC0 citations42
US10600830B2Mar 24, 2020
Sensor package structure
KINGPAK TECH INC0 citations40
TU HSIU-WEN
8 patentsUS8563350B2Oct 22, 2013
Wafer level image sensor packaging structure and manufacturing method for the same
TU HSIU-WEN7 citations82
US8440488B2May 14, 2013
Manufacturing method and structure for wafer level image sensor module with fixed focal length
TU HSIU-WEN8 citations82
US8390087B2Mar 5, 2013
Image sensor package structure with large air cavity
TU HSIU-WEN7 citations80
US8928104B2Jan 6, 2015
Image sensor packaging structure with black encapsulant
TU HSIU-WEN4 citations71
US8847146B2Sep 30, 2014
Image sensor package structure with casing including a vent without sealing and in communication with package material
TU HSIU-WEN4 citations71
US8441086B2May 14, 2013
Image sensor packaging structure with predetermined focal length
TU HSIU-WEN6 citations71
US8093674B2Jan 10, 2012
Manufacturing method for molding image sensor package structure and image sensor package structure thereof
TU HSIU-WEN5 citations61
US8828777B2Sep 9, 2014
Wafer level image sensor packaging structure and manufacturing method of the same
TU HSIU-WEN0 citations50