Inventor
HORTON RAYMOND R
US29 patents
⚠️ This page may combine multiple inventors who share the name “HORTON RAYMOND R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
28 patentsUS6534863B2Mar 18, 2003
Common ball-limiting metallurgy for I/O sites
IBM112 citations98
US7276787B2Oct 2, 2007
Silicon chip carrier with conductive through-vias and method for fabricating same
IBM124 citations96
US4875614AOct 24, 1989
Alignment device
IBM90 citations96
US7435627B2Oct 14, 2008
Techniques for providing decoupling capacitance
IBM18 citations93
US5263620ANov 23, 1993
Wirebond removal apparatus using alternating fluid stream
IBM30 citations92
US5186632AFeb 16, 1993
Electronic device elastomeric mounting and interconnection technology
IBM36 citations92
US5117275AMay 26, 1992
Electronic substrate multiple location conductor attachment technology
IBM28 citations92
US5052606AOct 1, 1991
Tape automated bonding feeder
IBM27 citations92
US5006925AApr 9, 1991
Three dimensional microelectric packaging
IBM25 citations92
US4937006AJun 26, 1990
Method and apparatus for fluxless solder bonding
IBM43 citations89
US7488624B2Feb 10, 2009
Techniques for providing decoupling capacitance
IBM9 citations84
US7449067B2Nov 11, 2008
Method and apparatus for filling vias
IBM12 citations82
US7791168B2Sep 7, 2010
Techniques for providing decoupling capacitance
IBM6 citations74
US7741231B2Jun 22, 2010
Techniques for providing decoupling capacitance
IBM4 citations74
US7691669B2Apr 6, 2010
Techniques for providing decoupling capacitance
IBM7 citations74
US5233221AAug 3, 1993
Electronic substrate multiple location conductor attachment technology
IBM11 citations73
US5229328AJul 20, 1993
Method for bonding dielectric mounted conductors to semiconductor chip contact pads
IBM17 citations73
US5074969ADec 24, 1991
Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate
IBM8 citations73
US5446261AAug 29, 1995
Solder application system using helix to control solder meniscus
IBM9 citations72
US5205461AApr 27, 1993
Method and apparatus for fluxless solder bonding
IBM16 citations72
US5676301AOct 14, 1997
Castellated nozzle and method of use thereof
IBM8 citations71
US8342385B2Jan 1, 2013
Process for mapping formic acid distribution
IBM4 citations62
US7282391B1Oct 16, 2007
Method for precision assembly of integrated circuit chip packages
IBM5 citations62
US7199450B2Apr 3, 2007
Materials and method to seal vias in silicon substrates
IBM2 citations62
US5038195AAug 6, 1991
Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate
IBM4 citations62
US7615405B2Nov 10, 2009
Method for precision assembly of integrated circuit chip packages
IBM0 citations52
US5322204AJun 21, 1994
Electronic substrate multiple location conductor attachment technology
IBM0 citations52
US5593083AJan 14, 1997
Castellated nozzle and method of use therof
IBM0 citations50